NDLI: Recent advancements in MCM-L imaging and via generation by laser direct writing

Content Provider	IEEE Xplore Digital Library
Author	Illyefalvi-Vitez, Z. Ruszinko, M. Pinkola, J.
Copyright Year	1998
Description	Author affiliation: Dept. of Electron. Technol., Tech. Univ. Budapest, Hungary (Illyefalvi-Vitez, Z.)
Abstract	The paper presents some preliminary results and describes the state of a research project that aims at the improvement of the quality of MCM-L circuit boards by the application of UV lasers for the following processes. 1) Pattern generation by direct writing using Nd:YAG (IR, visible or UV) laser. The copper clad laminate is covered by some protective layer, and the pattern is directly written to this layer by material removal (ablation). The pattern of the copper layer is prepared either by wet chemical etching or applying the electroplating-stripping-etching process sequence. 2) Photo-mask exposure by direct writing. In this case a photoresist protective layer is exposed by a UV He-Cd laser, and after developing it is used for the conventional image transfer process. 3) Through board via generation by contour direct writing using frequency multiplied Nd:YAG laser. It means that holes are drilled by moving the well-focused laser beam along their contour. 4) Blind via generation by controlled number of pulses using the same frequency multiplied Nd:YAG laser. In this case the whole area of the via is exposed, and the hole is deepened shot by shot.
Starting Page	144
Ending Page	150
File Size	1240633
Page Count	7
File Format	PDF
ISBN	0780345266
ISSN	05695503
DOI	10.1109/ECTC.1998.678684
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-05-25
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Laser ablation Writing Chemical lasers Copper Protection Frequency Optical pulse generation Optical imaging Printed circuits Laser applications
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Laser Drilling of Copper Foils for Electronics Applications

Optimizing mask materials and laser pattern transfer processing for cheap MCM-L fast prototyping and special sensor applications

Fabrication of multiple-wavelength lasers in InGaAs-InGaAsP structures using direct laser writing

Powerful UV laser oscillation on copper and gold ion lines in nanosecond pulsed longitudinal discharges

Laser-Assisted Reduction of Highly Conductive Circuits Based on Copper Nitrate for Flexible Printed Sensors

Applications of cascade nonlinearities to femtosecond pulse generation and propagation

Ultrafast X-ray generation and applications using laser-linac interactions

Optical fiber delivery of intense ultrashort laser for endoscopic medical applications

Processing of hydroxyapatite and collagen by tailored femtosecond laser pulse

Recent advancements in MCM-L imaging and via generation by laser direct writing

Similar Documents

Laser Drilling of Copper Foils for Electronics Applications

Optimizing mask materials and laser pattern transfer processing for cheap MCM-L fast prototyping and special sensor applications

Fabrication of multiple-wavelength lasers in InGaAs-InGaAsP structures using direct laser writing

Powerful UV laser oscillation on copper and gold ion lines in nanosecond pulsed longitudinal discharges

Laser-Assisted Reduction of Highly Conductive Circuits Based on Copper Nitrate for Flexible Printed Sensors

Applications of cascade nonlinearities to femtosecond pulse generation and propagation

Ultrafast X-ray generation and applications using laser-linac interactions

Optical fiber delivery of intense ultrashort laser for endoscopic medical applications

Processing of hydroxyapatite and collagen by tailored femtosecond laser pulse

Recent advancements in MCM-L imaging and via generation by laser direct writing