NDLI: Intermetallic compound growth on Ni, Au/Ni, and Pd/Ni substrates with Sn/Pb, Sn/Ag, and Sn solders [PWBs]

Content Provider	IEEE Xplore Digital Library
Author	Blair, H.D. Tsung-Yu Pan Nicholson, J.M.
Copyright Year	1998
Description	Author affiliation: Res. Lab., Ford Motor Co., Dearborn, MI, USA (Blair, H.D.)
Abstract	The growth mechanism of the Ni/sub 3/Sn/sub 4/ intermetallic compound (IMC) during aging was studied with three different solders (100Sn, Sn-3.5Ag, and Sn-37Pb) on three different substrates (Ni, Ni/Au, and Ni/Pd), at the temperatures of 75, 100, 125, and 160/spl deg/C from 1 to 36 days. The growth rates of Ni/sub 3/Sn/sub 4/ with Sn on Ni and Ni/Au substrates were similar, growing to about 6 /spl mu/m after 36 days at 160/spl deg/C, but only to about 1-2 /spl mu/m after 36 days at a temperature below 100/spl deg/C. The growth rate of Ni/sub 3/Sn/sub 4/ with Sn-37Pb on Ni/Au substrate was close to that with Sn for the same substrates. However, the Sn-3.5Ag solder showed a slower growth rate of Ni/sub 3/Sn/sub 4/ on both Ni and Ni/Au substrates, resulting in only about half the thicknesses when compared to Sn on the same substrates. In addition to the Ni/sub 3/Sn/sub 4/ compound, a PdSn/sub 4/ compound was observed on the NiPd substrates. The growth rate of Ni/sub 3/Sn/sub 4/ on the Ni/Pd substrate is much slower than that on either the Ni or the Ni/Au substrate, possibly due to the existence of the PdSn/sub 4/ layer between Ni and the solder. At temperatures lower than 100/spl deg/C, there is hardly any Ni/sub 3/Sn/sub 4/ detected for Sn-3.5Ag and Sn-37Pb solders for up to 36 days. The apparent activation energies, Q, are in the range of 3 to 12.8 Kcal/mole, and Q for Ni/sub 3/Sn/sub 4/ with Sn is the highest for the three solders on both the Ni and Ni/Pd substrates, and those for Sn-3.5Ag the lowest. However, Q for Ni/sub 3/Sn/sub 4/ growth with Sn-3.5Ag is the highest on the Ni/Au substrate. A thick Ni/sub 3/Sn/sub 4/ layer may pose potential reliability issues as evidenced by the fractured morphology of the intermetallics due to a 10.7% volume shrinkage during the transformation from solid phase Sn and Ni to the Ni/sub 3/Sn/sub 4/ compound.
Starting Page	259
Ending Page	267
File Size	1613320
Page Count	9
File Format	PDF
ISBN	0780345266
ISSN	05695503
DOI	10.1109/ECTC.1998.678704
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-05-25
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Tin Intermetallic Gold Nickel Temperature Soldering Copper Aging Surface morphology Solid state circuits
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Effect of Solder Volume on Interfacial Reactions between Eutectic Sn-Pb and Sn-Ag-Cu Solders and Ni(P)-Au Surface Finish

Study of intermetallic growth on PWBs soldered with Sn/sub 3.0/Ag/sub 0.5/Cu

Intermetallic compound formation in Sn-Co-Cu, Sn-Ag-Cu and eutectic Sn-Cu solder joints on electroless Ni(P) immersion au surface finish after reflow soldering

Intermetallic growth on PWBs soldered with Sn3.8Ag0.7Cu

Comparison of Interfacial Stability of Pb-Free Solders (Sn—3.5Ag, Sn—3.5Ag—0.7Cu, and Sn—0.7Cu) on ENIG-Plated Cu During Aging

Effect of surface finish metallurgy on intermetallic compounds during soldering with tin-silver-copper solders

Interfacial Reactions between Sn-Cu Based Multicomponent Solders and Ni Substrates during Soldering and Aging

Interfacial microstructure and shear strength of Sn-Ag-Cu based composite solders on Cu and Au/Ni metallized Cu substrates

Effect of phosphorus content and solid state aging on intermetallic formation between lead-free Sn-Ag-Cu solder and electroless nickel/immersion gold under bump metallurgy

Intermetallic compound growth on Ni, Au/Ni, and Pd/Ni substrates with Sn/Pb, Sn/Ag, and Sn solders [PWBs]

Similar Documents

Effect of Solder Volume on Interfacial Reactions between Eutectic Sn-Pb and Sn-Ag-Cu Solders and Ni(P)-Au Surface Finish

Study of intermetallic growth on PWBs soldered with Sn/sub 3.0/Ag/sub 0.5/Cu

Intermetallic compound formation in Sn-Co-Cu, Sn-Ag-Cu and eutectic Sn-Cu solder joints on electroless Ni(P) immersion au surface finish after reflow soldering

Intermetallic growth on PWBs soldered with Sn3.8Ag0.7Cu

Comparison of Interfacial Stability of Pb-Free Solders (Sn—3.5Ag, Sn—3.5Ag—0.7Cu, and Sn—0.7Cu) on ENIG-Plated Cu During Aging

Effect of surface finish metallurgy on intermetallic compounds during soldering with tin-silver-copper solders

Interfacial Reactions between Sn-Cu Based Multicomponent Solders and Ni Substrates during Soldering and Aging

Interfacial microstructure and shear strength of Sn-Ag-Cu based composite solders on Cu and Au/Ni metallized Cu substrates

Effect of phosphorus content and solid state aging on intermetallic formation between lead-free Sn-Ag-Cu solder and electroless nickel/immersion gold under bump metallurgy

Intermetallic compound growth on Ni, Au/Ni, and Pd/Ni substrates with Sn/Pb, Sn/Ag, and Sn solders [PWBs]