NDLI: GHz flip chip-an overview

Content Provider	IEEE Xplore Digital Library
Author	Boustedt, K.
Copyright Year	1998
Description	Author affiliation: Core Unit Res. Center, Ericsson Microwave Syst. AB, Molndal, Sweden (Boustedt, K.)
Abstract	The drive in industry towards more and more wireless communication for various purposes increases the need for packaging for ever higher frequencies. This paper gives an overview of recent activities, presented by companies and universities, at GHz frequencies. The main topic is the chip interconnect, and GaAs flip chip specifically, Flip chip offers some very significant advantages over wire bonding, such as better electrical performance and smoother assembly process. This makes way for lower production costs and allows for low cost high volume production of both consumer and other products. For lower frequencies, this is well documented, and an increase in activity for high frequencies is now seen. If one is to judge by the number of papers presented, it seems that most of the activities are in USA, Europe, and Asia. In Europe, Germany presents the most results, and in Asia, various Japanese companies dominate. However, it is likely that most of the well known telecom and radar companies are actively investigating flip chip for high frequencies, without presenting the results. Papers are mostly concerned with chip design issues, and simulations of various structures. The coplanar chip design appears to be favored, along with non-melting bumps for interconnect.
Starting Page	297
Ending Page	302
File Size	656257
Page Count	6
File Format	PDF
ISBN	0780345266
ISSN	05695503
DOI	10.1109/ECTC.1998.678709
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-05-25
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Frequency Flip chip Production Costs Europe Asia Chip scale packaging Communication industry Wireless communication Educational institutions
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
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8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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