NDLI: Advanced thermal interface materials for enhanced flip chip BGA

Content Provider	IEEE Xplore Digital Library
Author	Kohli, P. Sobczak, M. Bowin, J. Matthews, M.
Copyright Year	2001
Description	Author affiliation: Ablestik Labs., Rancho Dominguez, CA, USA (Kohli, P.)
Abstract	A family of advanced thermal interface materials for high-power flip-chip BGA (FCBGA) packages is discussed. These silver-filled adhesives provide for high reliability on laminate FCBGA packages. Laser flash thermal testing is utilized to demonstrate that these materials not only have low bulk thermal resistance, but also very low interfacial, or contact resistance. These adhesives have a low modulus and high adhesion, which enables them to flex and remain bonded as the laminate package undergoes stress during temperature cycling. Data also show that this family of TIMs has very low moisture absorption, which contributes to excellent adhesive reliability during HAST (highly accelerated stress test). Reliability data on laminate test packages will be presented. This family of materials has been shown to pass more than 1000 cycles of temperature cycling B (-55 to +125/spl deg/C, liquid-to-liquid) and 200 hours HAST (121/spl deg/C, 100% relative humidity), after JEDEC Level 3 preconditioning and three reflow simulations at 220/spl deg/C on a laminate package with 10/spl times/10 mm die. Total thermal resistance of less than 0.10 cm/sup 2/ K/W has been achieved, at a 25 /spl mu/m bondline thickness.
Sponsorship	Components, Packaging, & Manuf. Technol. (CPMT) Soc. IEEE
Starting Page	564
Ending Page	570
File Size	656452
Page Count	7
File Format	PDF
ISBN	0780370384
ISSN	05695503
DOI	10.1109/ECTC.2001.927784
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-05-29
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Flip chip Packaging Thermal resistance Laminates Optical materials Contact resistance Bonding Temperature Materials testing Adhesives
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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