NDLI: An innovative technique for packaging power electronic building blocks using metal posts interconnected parallel plate structures

Content Provider	IEEE Xplore Digital Library
Author	Haque, S. Kun Xing Ray-Lee Lin Suchicital, C. Lu, G.-Q. Nelson, D.J. Borojevic, D. Lee, F.C.
Copyright Year	1998
Description	Author affiliation: Power Electron. Center, Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA (Haque, S.)
Abstract	Power Electronics Building Blocks (PEBBs) are envisioned as integrated power modules consisting of power semiconductor devices, power integrated circuits, sensors, and protection circuits for a wide range of power electronics applications, such as inverters for motor drives and converters for power processing equipment. At Virginia Power Electronics Center (VPEC), we developed a topology for a basic building block-a two-switch two-diode half-bridge converter in totem-pole configuration with built-in gate-driver and protection circuitry, fiber-optic receiver/transmitter interface, and soft-switching capability. Based on the topology, a series of prototype modules, with 600 V, 3.3 kW rating, were fabricated using an innovative packaging technique developed for the program-metal posts interconnected parallel plate structure (MPIPPS). This new packaging technique uses direct attachment of bulk copper, not wire-bonding of fine aluminum wires, for interconnecting power devices. Electrical performance data of the packaged devices show that an air-cooled 15 kW inverter, operating from 400 V dc bus with 20 kHz switching frequency can be constructed by integrating three prototype modules, which is almost double of what could not be achieved with commercially packaged devices of the same rating.
Starting Page	922
Ending Page	929
File Size	1188520
Page Count	8
File Format	PDF
ISBN	0780345266
ISSN	05695503
DOI	10.1109/ECTC.1998.678819
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-05-25
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electronics packaging Power electronics Protection Inverters Circuit topology Prototypes Integrated circuit interconnections Integrated circuit packaging Semiconductor device packaging Packaging machines
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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