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  1. IEEE Transactions on Components, Hybrids, and Manufacturing Technology
  2. Year : 1984 Volume : 7
  3. Issue 2
  4. Silicon-On-Silicon Packaging
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Year : 1993 Volume : 16
Year : 1992 Volume : 15
Year : 1991 Volume : 14
Year : 1990 Volume : 13
Year : 1989 Volume : 12
Year : 1988 Volume : 11
Year : 1987 Volume : 10
Year : 1986 Volume : 9
Year : 1985 Volume : 8
Year : 1984 Volume : 7
Issue 4
Issue 3
Issue 2
Editorial
The Microstructure of RuO2Thick Film Resistors and the Influence of Glass Particle Size on their Electrical Properties
Cleaning Processes For HIC's with Solder Paste
Bond-Integrity Testing of Sapphire Chips Mounted with Eutectic Preforms
Silicon-On-Silicon Packaging
The VLSI Package-An Analytical Review
Failure Modes of InGaAsP/InP Lasers Due to Adhesives
Issue 1
Year : 1983 Volume : 6
Year : 1982 Volume : 5
Year : 1981 Volume : 4
Year : 1980 Volume : 3
Year : 1979 Volume : 2
Year : 1978 Volume : 1

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Silicon-On-Silicon Packaging

Content Provider IEEE Xplore Digital Library
Author Spielberger, R. Huang, C. Nunne, W. Mones, A. Fett, D. Hampton, F.
Copyright Year 1978
Abstract Honeywell's new packaging technique uses silicon as a multichip substrate. Multiple integrated circuit (IC) chips are flip bonded by controlled collapse joining to a silicon substrate. The silicon substratc provides the interconnections between chips and the next level of interface. The silicon substrate is subseqently epoxy bonded to a ceramic substrate, and the package is then completed by wire bonding and hermetic sealing. Silicon-on-silicon packaging offers six advantages: 1) excellent thermal matching, 2) high packaging density, 3) commonality of fabrication using conventional IC processes, 4) low cost per function, 5) repairability, 6) and mixing of IC technologies (MOS bipolar linear, etc.) on the same silicon substrate.
Sponsorship IEEE Electronic Industries Alliance American Society of Mechanical Engineering (ASME) NBS SAE
Starting Page 193
Ending Page 196
Page Count 4
File Size 567759
File Format PDF
ISSN 01486411
Volume Number 7
Issue Number 2
Language English
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date 1984-06-01
Publisher Place U.S.A.
Access Restriction Subscribed
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword Silicon Integrated circuit packaging Substrates Bonding Ceramics Packaging machines Integrated circuit interconnections Wire Flip chip Electronics packaging
Content Type Text
Resource Type Article
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