NDLI: Methodology for screening high performance underfill materials

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Methodology for screening high performance underfill materials

Content Provider	IEEE Xplore Digital Library
Author	Hoang, L. Murphy, A. Desai, K.
Copyright Year	1998
Description	Author affiliation: LSI Logic Corp., Fremont, CA, USA (Hoang, L.)
Abstract	This paper discusses screening methodologies to test for processability and reliability of underfill materials. The processability of underfills can be determined by flow studies at different temperatures. The larger process window points to a more robust material. In addition, a shear test method was developed for measuring the strengths of assembled parts following moisture soaking conditions. Confirmation builds subjected to JEDEC preconditioning level 3 and 4 yield good correlation with the results from the screening methodology.
Starting Page	111
Ending Page	116
File Size	800417
Page Count	6
File Format	PDF
ISBN	0780345266
ISSN	05695503
DOI	10.1109/ECTC.1998.678679
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-05-25
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Materials testing Soldering Moisture Silicon Materials reliability Flip chip Material properties Logic testing Temperature Fatigue
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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