NDLI: Precision molding of plastic connectors directly on single-mode fibers

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Nonlinear mechanical modeling of electrical connectors using simple numerical methods and secant modulus data

Mating mechanics and stubbing of separable connectors

Formation of electrical contact through an Alodine coating

The interface resistance between a cadmium plated connector and an Alodined aluminum bracket

Study on the method of reliability predication for contacts

Thermal fatigue reliability analysis of redistributed flip chip assemblies

Enhancement of multichip modules (MCMs) cooling by incorporating micro-heat pipes and other high thermal conductivity materials into microchannel heat sinks

Transient heat conduction analysis of electronic packages by coupled boundary and finite element methods

Thermal simulation and validation of the fast static RAM 164-lead FC-PBGA package with investigations of package thermal performance in a generic CPU module

Thermal characterization of multi-die BGA packages

Thermal dissipation analysis in flip chip on board and chip on board assemblies

Solder joint reliability of a lead-less RF-transistor

Novel thermally reworkable underfill encapsulants for flip-chip applications

Flow properties of liquid underfill encapsulations and underfill process considerations

High reliability, high density, low cost packaging systems for matrix BGA and CSP using VPES (vacuum printing encapsulation systems)

Methodology for screening high performance underfill materials

Study of the fluxing agent effects on the properties of no-flow underfill materials for flip-chip applications

Enhancement of underfill performance for flip-chip applications by use of silane additives

Polymer interfacial adhesion in microelectronic assemblies

Epoxy-based aqueous-processable photodielectric dry film and conductive ViaPlug for PCB build-up and IC packaging

Recent advancements in MCM-L imaging and via generation by laser direct writing

P-4 process. A novel high-density, low-cost multilayer planar thin-film PWB technology

New high-density multilayer technology on PCB

Improvements and recent advances in nanocomposite capacitors using a colloidal technique

Barium titanate/epoxy composite dielectric materials for integrated thin film capacitors

Flip chip equipment for high end electro-optical modules

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A compact MU interface 2.5-Gb/s optical transmitter module with an embedded LD-driver IC

Unisolated 2.5 Gbit/s uncooled gain-coupled 1300 nm DFB lasers for low cost applications

A new family of ferruleless fiber-optic transceivers

Automatic power control of a VCSEL using an angled lid TO56 package

A compact optical active connector: An optical interconnect module with an electrical connector interface

Economic and technical viability of integral passives

Direct-write fabrication of integrated, multilayer ceramic components

Thin film resistors and capacitors for multichip modules

Electroless Ni-P/Ni-W-P thin-film resistors for MCM-L based technologies

Electrical characterization of multilayered thin film integral passive devices

Anodization for forming thin film embedded capacitors in MCM-D and MCM-L substrates

High-performance RF coil inductors on silicon

Fluxless FC-soldering in O/sub 2/ purged ambient

Intermetallic compound growth on Ni, Au/Ni, and Pd/Ni substrates with Sn/Pb, Sn/Ag, and Sn solders [PWBs]

FAIR-fast assessment of interconnect reliability

Eutectic Sn-Bi as an alternative to Pb-free solders

High temperature joints manufactured at low temperature

Reliability studies of plastic ball grid array assemblies reflowed in nitrogen ambient

GHz flip chip-an overview

Reliability investigations for flip-chip on flex using different solder materials

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A study of a new flip chip packaging process for diversified bump and land combination

Film chip interconnect systems prepared by wet chemical metallization

Flip-chip bonding on 6-/spl mu/m pitch using thin-film microspring technology

Impacting electronic package design by validated simulations

Analysis and modeling verification for thermal-mechanical deformation in flip-chip packages

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Process modeling for sequential build-up of multi-layered structures

The effect of underfill imperfections on the reliability of flip chip modules: FEM simulations and experiments

Moisture-induced interfacial delamination growth in plastic IC packages during solder reflow

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Tacky Dots/sup TM/ transfer of solder spheres for flip chip and electronic package applications

Development of ball bump forming technology using solder paste and new simplified CSP

Tacky Dots/sup TM/ technology for flip chip and BGA solder bumping

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Influence of process variables on the reliability of microBGA/sup TM/ package assemblies

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Reliability and failure analyses of thermally cycled ball grid array assemblies

Characterization of underfill/passivation interfacial adhesion for direct chip attach assemblies using fracture toughness and hydro-thermal fatigue measurements

Die cracking in flip chip assemblies

Development of a new solder joint modeling tool for IC package designers

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Electrical design and simulation of high density printed circuit boards

Manufacturing experience with high performance mixed dielectric circuit boards

A relative comparison of PWB warpage due to simulated infrared and wave soldering processes

Development of single-point laser bonding process for TCP outer-lead-bonding

Solid state UV-laser technology for the manufacture of high performance organic modules

Precision molding of plastic connectors directly on single-mode fibers

The execution of aggressive PBGA substrate yield learning in an existing PWB facility

Correlation of flip chip underfill process parameters and material properties with in-process stress generation

Effective elastic modulus of underfill material for flip-chip applications

Thermomechanical reliability assessment of large organic flip-chip ball grid array packages

Reliability and process characterization of electroless Nickel-Gold/Solder flip chip interconnect technology

Reliability of flip chip on board. First order model for the effect on contact integrity of moisture penetration in the underfill

Thermal fatigue of solder flip-chip assemblies

Thermo-mechanical analysis of solder joint fatigue and creep in a flip chip on board package subjected to temperature cycling loading

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Hermetic-equivalent packaging of GPS MCM-L modules for high reliability avionics applications

Use of compliant adhesives in the large area processing of MCM-D substrates

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Known good die, die replacement (rework), and their influences on multichip module costs

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Enhancing moisture resistance of PBGA

Analysis of delamination in IC packages using a new variable-order singular boundary element

Investigations on popcorn cracking of T-QFP packages

Brittle interfacial fracture of PBGA packages soldered on electroless nickel/immersion gold

Resolution and signal loss in acoustic microscopy of encapsulated IC packages

Visco-elastic-plastic properties and constitutive modeling of underfills

Real-time warpage measurement of electronic components with variable sensitivity

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Synthesis of RF circuits for embedded passive components in mixed signal applications

Theoretical and experimental approach for model extraction of multiconductor interconnects with multiple meshed planes on an APCB

Interconnection line structures on MCM-Si for giga-hertz quasi-TEM signal transmission

Signal integrity optimization of high-speed VLSI packages and interconnects

Dielectric constant and loss tangent measurement using a stripline fixture

Validity of mutual inductor model for electromagnetic coupling between vias in integrated-circuit packages and printed circuit boards

High density organic flip chip package substrate technology

Pad redistribution technology for flip chip applications

Comparison of the shear strength and reliability between gold-plated and bare copper lands of a BGA package

A CMOS image sensor module applied for a digital still camera utilizing the TOG (TAB On Glass) bonding method

RF flip-module BGA package

Study of molding compound for BGA [package]

Development of moisture-proof thin and large QFP with copper lead frame

Adhesion integrity evaluation of plastic encapsulated semiconductor package

The effect of die attach layer delamination on the thermal performance of plastic packages

Optimal oxidation control for enhancement of copper lead frame-EMC adhesion in packaging process

An analytical characterization and reliability testing of an adhesion enhancing Zn-Cr leadframe coating for popcorn prevention

Surface treatment of copper for the adhesion improvement to epoxy mold compounds

The evaluation of high-reliability adhesive film for T-BGA

New types of optoelectronic molding compounds

Adhesives for optical devices

Reliability study of an epoxy-bonded laser-to-fiber assembly

Low power consumption molded gigabit fiberoptic transceiver module

Long wavelength transparent epoxy mold optical data link

Packaging aspects of the Jitney parallel optical interconnect

A cost effective ceramic package for LD/PD module in subscriber system

Thermal impedance of microwave integrated circuits with localized small heat sources

Three dimensional die surface stress measurements in delaminated and non-delaminated plastic packages

The development of a top-bottom-BGA (TB-BGA)

Property trend analysis and simulations of adhesive formulation effects in the microelectronics packaging industry using molecular modeling

Integrated solenoid-type inductors for high frequency applications and their characteristics

Characterization of a no-flow underfill encapsulant during the solder reflow process

Evaluation of solder joint reliability between PWB and CSP by using high TCE ceramic material

Probabilistic prediction of wireability and routing requirements for high density interconnect substrates

High performance packaging technique used for clamped gain semiconductor optical amplifier array modules fabrication

Scaleable high power pump laser modules with high efficiency and high reliability

Electrical modeling of the chip scale BGA

MCM structures with poled dielectrics to improve testability

Encapsulant materials for flip-chip attach

Improvement in reliability with CCGA column density increase to 1 mm pitch

Thermocompression bonding of aluminum bumps in TAB applications

Computational simulation of underfill encapsulation of flip-chip ICs. I. Flow modeling and surface-tension effects

Thermosonic flip chip bonding system with a self-planarization feature using polymer

IC chip stress during plastic package molding

Multi-domain analysis of PBGA solder joints for structural design optimization

TMA, DMA, DSC, and TGA of lead free solders

Resolving displacement field of solder ball in flip-chip package by both phase shifting moire interferometry and FEM modeling

Integrated flow-thermomechanical and reliability analysis of a low air cooled flip chip-PBGA package

Characterization of underfill materials for functional solder bumped flip chips on board applications

Moisture diffusion and vapour pressure modeling of IC packaging

Electromagnetic analysis of high-density multi-chip module substrates having semi-custom interconnects

A new technique for high frequency characterization of capacitors

Load resistor effect on intermodulation distortion in CATV PINs

Design, simulation and technological realization of a reliable packaging concept for high power laser bars

A new nonepoxy liquid die attach adhesive

Thermal analysis of a chip scale package technology

O/e-MCM packaging with new, patternable dielectric and optical materials

Relationship between initial thermal characteristics and lifetime projection of semiconductor laser diodes

Transient thermal measurement of laser diodes

Thermo-mechanical creep of two solder alloys

Creep behavior of a flip-chip package by both FEM modeling and real time moire interferometry

In package micro-aligner for fiber-optic packaging

Fracture of optical fibers in connectors

Finite element thermal model for high power transients in microelectronics with CVD diamond heat spreaders

Quantitative evaluation of passive-aligned laser diode-to-fiber coupling

Comparison of advanced measurement and modeling techniques for electrical characterization of ball grid array packages

Micro-ball bump for flip chip interconnections

Trends in BGA design methodologies

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Precision molding of plastic connectors directly on single-mode fibers

Content Provider	IEEE Xplore Digital Library
Author	Lundstrom, P. Eriksen, P. Engstrand, J.-A. Lindstrom, B. Moll, H.-C.
Copyright Year	1998
Description	Author affiliation: Ericsson Components AB, Stockholm, Sweden (Lundstrom, P.)
Abstract	A pre-connectorization technique using transfer molding of MT-compatible ferrules directly on single-mode optical fibers is reported. Insertion loss values of less than 1 dB are achieved for 85% of all measured fiber channels. The method is expected to provide a cost reduction of approximately 50%, compared to conventional termination techniques, which makes it an attractive solution for Fiber-to-the-Home field installations and other access applications where moderate performance can be accepted.
Starting Page	828
Ending Page	833
File Size	775813
Page Count	6
File Format	PDF
ISBN	0780345266
ISSN	05695503
DOI	10.1109/ECTC.1998.678803
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-05-25
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Plastics Connectors Optical fibers Rubber Transfer molding Insertion loss Costs Optical fiber networks Samarium Fabrication
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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