NDLI: High density organic flip chip package substrate technology

Content Provider	IEEE Xplore Digital Library
Author	Petefish, W.G. Noddin, D.B. Hanson, D.A. Gorrell, R.E. Syvester, M.F.
Copyright Year	1998
Description	Author affiliation: W.L. Gore & Assoc., Eau Clair, WI, USA (Petefish, W.G.)
Abstract	High performance logic ICs are rapidly migrating from peripheral bonded package configurations to area array, flip chip configurations. Total die I/O is exploding from <800 pins to more than 3500 pins with little abatement in the rate of increase in total silicon area. Traditional flip chip package substrate technologies, such as co-fired ceramic, are not able to adequately support this growing industry trend due to inherent limitations in thermal cycling reliability of the level 2 interface, density, electrical performance, and cost of use. A new, cost effective, organic flip chip package substrate technology has been developed, prototyped, qualified, and is being ramped into production. This laminated technology uses a nonwoven polytetrafluoroethylene (PTFE) composite dielectric combined with a fabrication technology that has produced the highest density organic substrates yet disclosed. The technology has been used to fabricate packages for die up to 18.5 mm by 18.5 mm with more than 3800 total I/O. Body sizes of up to 45 mm have been fabricated. In this paper, we will discuss the materials of construction, process technology, reliability characterization, thermo-mechanical characterization, and electrical performance of various cross-sections using this new technology.
Starting Page	1089
Ending Page	1097
File Size	1316333
Page Count	9
File Format	PDF
ISBN	0780345266
ISSN	05695503
DOI	10.1109/ECTC.1998.678850
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-05-25
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Flip chip Packaging Dielectric substrates Logic arrays Pins Costs Bonding Silicon Ceramics industry Electrical products industry
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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