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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Haake, J.M. Beranek, M.W. |
| Copyright Year | 1998 |
| Description | Author affiliation: Boeing Co., St. Louis, MO, USA (Haake, J.M.) |
| Abstract | We describe and demonstrate a 3-axis MEMS active fiber-optic micro-aligner, which will enable in-package alignment of fiber-optic and micro-optic components. The micro-aligner is a wafer level fabricated device, based on an integration of silicon micromachining and LIGA technology. The electrically controllable actuators demonstrate the high force and displacement necessary to overcome fiber-optic bending stiffness, counterforce springs, friction, and wirebonds, to perform active alignment of an optical fiber inside an optoelectronic package housing. We have demonstrated movement of >30 microns in all three axes in an in-package configuration. The first prototype devices are currently small enough (4/spl times/4/spl times/0.5 mm/sup 3/) to fit into a standard optoelectronic package. In the future we expect that micro-aligner devices with the same forces and displacements can be made smaller than 1/spl times/1/spl times/0.5 mm/sup 3/ thus allowing for multiple singlemode fiber-optic attachments inside standard optoelectronic package housings. |
| Starting Page | 1446 |
| Ending Page | 1449 |
| File Size | 800607 |
| Page Count | 4 |
| File Format | |
| ISBN | 0780345266 |
| ISSN | 05695503 |
| DOI | 10.1109/ECTC.1998.678934 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1998-05-25 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Packaging Optical fiber devices Wafer scale integration Micromechanical devices Silicon Micromachining Displacement control Force control Optical control Actuators |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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