NDLI: Interconnection line structures on MCM-Si for giga-hertz quasi-TEM signal transmission

Content Provider	IEEE Xplore Digital Library
Author	Woonghwan Ryu Hyungsoo Kim Jonghoon Kim Kyoungmin Ko Joungho Kim
Copyright Year	1998
Description	Author affiliation: Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Seoul, South Korea (Woonghwan Ryu)
Abstract	Recently, electrical performances of high-speed digital integrated circuits and MCMs have been limited by undesired RF phenomena of interconnection lines, such as delay attenuation, crosstalk, dispersion, reflection, and noise. Transmission line structures are required for future interconnection lines of the integrated circuits and MCMs to minimize the RF effects and, therefore, to maximize transmission bandwidth and minimize signal loss of the interconnection lines. Also, to predict those effects, it is necessary to use correct and simple electrical models of the transmission line structures. In this paper, we propose new embedded microstrip structures, such as an embedding microstrip (EM) and an inverted embedding microstrip (IEM) structures for the MCM-Si interconnection line. The proposed IEM and EM structures are proven to be less lossy and dispersive at high frequencies than the conventional MCM-Si interconnection line structures. The proposed line structures were demonstrated to support low loss quasi-TEM mode propagation through the lines. The characteristics and frequency dependent electrical models of the proposed structures will be reported based on microwave S-parameter measurements up to 20 GHz.
Starting Page	1068
Ending Page	1072
File Size	500881
Page Count	5
File Format	PDF
ISBN	0780345266
ISSN	05695503
DOI	10.1109/ECTC.1998.678846
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-05-25
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Integrated circuit interconnections Microstrip Radio frequency Crosstalk Distributed parameter circuits Propagation losses Digital integrated circuits Delay lines Attenuation Acoustic reflection
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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