NDLI: Brittle interfacial fracture of PBGA packages soldered on electroless nickel/immersion gold

Content Provider	IEEE Xplore Digital Library
Author	Zequn Mei Kaufmann, M. Eslambolchi, A. Johnson, P.
Copyright Year	1998
Description	Author affiliation: Electron. Assembly Dev. Center, Hewlett-Packard Co., Palo Alto, CA, USA (Zequn Mei)
Abstract	Electroless nickel (Ni)/immersion gold (Au), an alternative metal finish on printed circuit board (PCB), has been used successfully for many electronic products. However, brittle fracture of PBGA packages soldered on this metal finish was reported recently by several companies. This paper describes brittle fracture in mechanical testing of thermal enhanced, cavity-down PBGA packages, in the as-reflowed and the aged conditions. In the as-reflowed condition, the fracture is a cleavage between PBGA solder balls and PCB conducting pads. The fracture loads, determined from four-point bending, were typically half of that for peeling off PCB conducting pads. Failure analysis showed that the fracture occurred at the interface between Ni/sub 3/Sn/sub 4/ and Ni-P. Three possible failure mechanisms were explored: (1) phosphorous segregation at the interface, (2) contamination or oxidation during the Ni-Au plating or after plating via diffusion, and (3) brittle fracture of Ni-P and Ni/sub 3/Sn/sub 4/. After aging at 150/spl deg/C for a few days, the AuSn/sub 4/ particles, once in the interior of solder joint in the as-reflowed condition, migrated onto the interface. The weak adhesion between Ni/sub 3/Sn/sub 4/ and AuSn/sub 4/ resulted in a more brittle fracture than that before the aging. This Au-related brittle fracture occurred although the Au concentration in solder joint was only 0.1 wt%, much less than 3 wt%, the rule of thumb concentration for brittle solder joint. The Au-related interfacial fracture may be eliminated by reflow after the aging which moved the AuSn/sub 4/ back to the solder joint interior.
Starting Page	952
Ending Page	961
File Size	2500763
Page Count	10
File Format	PDF
ISBN	0780345266
ISSN	05695503
DOI	10.1109/ECTC.1998.678824
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-05-25
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Nickel Aging Soldering Gold Electronic packaging thermal management Tin Failure analysis Electronics packaging Printed circuits Circuit testing
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Failure mechanism of brittle solder joint fracture in the presence of electroless nickel immersion gold (ENIG) interface

Thermal fatigue reliability enhancement of plastic ball grid array (PBGA) packages

Comparison of Interfacial Stability of Pb-Free Solders (Sn—3.5Ag, Sn—3.5Ag—0.7Cu, and Sn—0.7Cu) on ENIG-Plated Cu During Aging

Is electroless nickel / electroless palladium / immersion gold (ENEPIG) the solution of lead free soldering on PCB and IC packaging applications?

Effects of Underfills on the Thermal-Cycling Tests of SnAgCu PBGA (Plastic Ball Grid Array) Packages on ImAg PCB (Printed Circuit Board)

Board-level thermal modeling of PBGA and CSP in natural and forced convection

Reliability of soldered joints in CSPs of various designs and mounting conditions

Failure analysis and virtual qualification of PBGA under multiple environmental loadings

A study on solder-joints fall-off failure of electroless nickel/immersion gold pad

Brittle interfacial fracture of PBGA packages soldered on electroless nickel/immersion gold

Similar Documents

Failure mechanism of brittle solder joint fracture in the presence of electroless nickel immersion gold (ENIG) interface

Thermal fatigue reliability enhancement of plastic ball grid array (PBGA) packages

Comparison of Interfacial Stability of Pb-Free Solders (Sn—3.5Ag, Sn—3.5Ag—0.7Cu, and Sn—0.7Cu) on ENIG-Plated Cu During Aging

Is electroless nickel / electroless palladium / immersion gold (ENEPIG) the solution of lead free soldering on PCB and IC packaging applications?

Effects of Underfills on the Thermal-Cycling Tests of SnAgCu PBGA (Plastic Ball Grid Array) Packages on ImAg PCB (Printed Circuit Board)

Board-level thermal modeling of PBGA and CSP in natural and forced convection

Reliability of soldered joints in CSPs of various designs and mounting conditions

Failure analysis and virtual qualification of PBGA under multiple environmental loadings

A study on solder-joints fall-off failure of electroless nickel/immersion gold pad

Brittle interfacial fracture of PBGA packages soldered on electroless nickel/immersion gold