NDLI: Packaging for a 40-channel parallel optical interconnection module with an over 25-Gb/s throughput

Content Provider	IEEE Xplore Digital Library
Author	Katsura, K. Usui, M. Sato, N. Ohki, A. Tanaka, N. Matsuura, N. Kagawa, T. Tateno, K. Hikita, M. Yoshimura, R. Ando, Y.
Copyright Year	1998
Description	Author affiliation: NTT Opto-Electron. Labs., Tokyo, Japan (Katsura, K.)
Abstract	NTT is currently working on a project aimed at developing an interconnection module which has high throughput and is both compact and cost-effective. This project is called "parallel interboard optical interconnection technology", or "ParaBIT". The ParaBIT module being developed as the first step in this project is a front-end module with 40 channels, throughput of over 25 Gb/s, and transmission over 100 m along multimode fibers. One major feature of this module is the use of vertical-cavity surface-emitting laser (VCSEL) arrays as very cost-effective light sources. These arrays also enable a packaging structure that includes transmitter and receiver in one package. To achieve super-multichannel performance, new high-density multiport Bare Fiber (BF) connectors have been developed for the optical interface of the modules. Unlike conventional optical connectors, the BF connectors do not need a ferrule or spring. This ensures physical contact with excellent insertion loss of less than 0.1 dB for every channel. A polymeric optical waveguide film with a 45/spl deg/ mirror for coupling to the VCSEL/PD arrays by passive optical alignment has also been developed. Also to ensure easy coupling between the VCSEL/PD array chips and the waveguide, a packaging technique has been developed to align and diebond the optical array chips on a substrate. This technique is called Transferred Multichip Bonding (TMB), and can be used to mount optical array chips on a substrate with a positioning error of only several micrometers. These packaging techniques offer the performance of an ultra-parallel interconnection in prototype ParaBIT modules.
Starting Page	755
Ending Page	761
File Size	1101064
Page Count	7
File Format	PDF
ISBN	0780345266
ISSN	05695503
DOI	10.1109/ECTC.1998.678792
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-05-25
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Packaging Optical interconnections Optical arrays Optical transmitters Optical receivers Optical films Optical polymers Vertical cavity surface emitting lasers Optical waveguides Connectors
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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