NDLI: Thermo-mechanical analysis of solder joint fatigue and creep in a flip chip on board package subjected to temperature cycling loading

Content Provider	IEEE Xplore Digital Library
Author	Pang, J.H.L. Tze-Ing Tan Sitaraman, S.K.
Copyright Year	1998
Description	Author affiliation: Sch. of Mech. & Production Eng., Nanyang Technol. Inst., Singapore (Pang, J.H.L.)
Abstract	Thermo-mechanical stress analysis was conducted on a flip-chip-on-board (FCOB) package with underfill encapsulation. The solder joint fatigue and creep deformation response were modeled for a typical temperature cycling loading of -55 to 125 C. Two temperature cycling loading models with and without the curing part of the temperature history for the encapsulation process were investigated. Two-dimensional plane-strain finite element models of the FCOB package were employed. Elasto-plastic and creep deformation behavior of solder was simulated under the temperature cycling conditions to obtain the stress and strain results. The finite element strain results were used in fatigue life prediction models.
Starting Page	878
Ending Page	883
File Size	527859
Page Count	6
File Format	PDF
ISBN	0780345266
ISSN	05695503
DOI	10.1109/ECTC.1998.678811
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-05-25
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermomechanical processes Soldering Fatigue Creep Temperature Deformable models Packaging Encapsulation Finite element methods Capacitive sensors
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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