NDLI: Parametric finite element analysis of solder joint reliability of flip chip on board

Content Provider	IEEE Xplore Digital Library
Author	Goh, T.J.
Copyright Year	1998
Description	Author affiliation: Assembly Technol. Dev., Intel Technol. Sdn. Bhd., Penang, Malaysia (Goh, T.J.)
Abstract	Numerous studies have indicated that by encapsulating the solder joint with underfill material, the reliability of flip chip on board (FCOB) assemblies can be effectively enhanced. Typical manufacturing processes for FCOB assembly with underfill, however, involve long throughput time and additional equipment sets which are undesirable for high volume manufacturing environments. Hence, design/process simplifications, if not total elimination of underfill from conventional FCOB assemblies, that can directly result in productivity gain should be considered. A comprehensive parametric finite element analysis has been conducted to assess the feasibility of FCOB structures with partial underfill (i.e. only the peripheral joints are encapsulated with underfill material). The effects of some critical design parameters such as die size, joint height, joint diameter, joint pitch, printed circuit board (PCB) thickness and material properties of underfill on the solder joint reliability of FCOB structures were investigated in this study. Two-dimensional nonlinear plane strain finite element models of FCOB packages are employed. Moire and IR Fizeau interferometry techniques are used to measure the thermal deformation of the FCOB for model validation. Elasto-plastic deformation behaviours of solder were simulated under thermal cyclic loading from -55/spl deg/C to 125/spl deg/C. Maximum effective elastic and plastic strains of the solder joint were calculated and used as the indicator for determination of the solder joint reliability.
Starting Page	57
Ending Page	62
File Size	497254
Page Count	6
File Format	PDF
ISBN	078035141X
DOI	10.1109/EPTC.1998.755979
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-12-10
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Finite element methods Soldering Assembly Joining materials Materials reliability Manufacturing processes Capacitive sensors Deformable models Flip chip Throughput
Content Type	Text
Resource Type	Article

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