NDLI: Chip scale package (CSP) solder joint reliability and modeling

Content Provider	IEEE Xplore Digital Library
Author	Amagai, M.
Copyright Year	1998
Description	Author affiliation: Dept. of New Package Dev., Texas Instrum. Japan, Oita, Japan (Amagai, M.)
Abstract	A viscoplastic constitutive model was used to analyze the thermally induced plastic and creep deformation and low cycle fatigue behavior of the solder joints in chip scale packages (CSP) mounted on PCBs. The time-dependent and time-independent viscoplastic strain rate and plastic hardening work factors of solder material were used in 2D plane strain finite element models. The viscoplastic strain rate data was fitted to the viscoplastic flow equation. The plastic hardening factors were considered in the evolution equation. Finite element models, incorporating the viscoplastic flow and evolution equations, were verified by temperature cycling tests on assembled CSPs. The effect of the cyclic frequency, dwell time, and temperature ramp rate on the viscoplastic deformation was studied for a tapeless lead-on-chip (LOC) CSP and a flexible substrate CSP. The ramp rate significantly affects the equivalent stress range in solder joints, while a dwell time in excess of 10 minutes per half cycle does not result in an increased strain range. The failure data from the experiments was fitted to the Weibull failure distribution and the Weibull parameters were extracted. After satisfactory correlation between experiment and model was observed, the effect of material properties and package design variables on the fatigue life of solder joints in CSPs was investigated and the primary factors affecting solder fatigue life were subsequently presented. Furthermore, a simplified model was proposed to predict solder fatigue life in CSPs.
Starting Page	216
Ending Page	223
File Size	1002808
Page Count	8
File Format	PDF
ISBN	0780350901
DOI	10.1109/IEMTIM.1998.704625
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-04-15
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	Organizing Committee
Subject Keyword	Chip scale packaging Soldering Fatigue Capacitive sensors Plastics Equations Finite element methods Temperature Deformable models Creep
Content Type	Text
Resource Type	Article

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