NDLI: An investigation into the effects of flux residues on properties of underfill materials for flip chip packages

Content Provider	IEEE Xplore Digital Library
Author	Fan Zhang Ming Li Chen, W.T. Chian, K.S.
Copyright Year	1999
Abstract	Flux is necessary to promote wetting between solder and metallized surfaces during flip chip bonding process. However, flux residues are unavoidable and may have detrimental effects on the properties of the underfill materials. In this study, the effects of flux residues from a commercial no-clean flux on two types of underfills were systematically investigated using a contact angle goniometer, thermal mechanical analyzer (TMA), thermogravimetric analyzer (TGA) and dynamic mechanical analyzer (DMA). It was found that the presence of flux residue reduced the glass transition temperatures (Tg) of both cured underfills studied. Although /spl alpha//sub 1/ (CTE below Tg) of cured underfills were slightly affected, /spl alpha//sub 2/ (CTE above Tg) increased significantly. The DMA tan/spl delta/ curves of flux residue contaminated samples were found to be broader than those of pure underfills. In addition, the rubbery storage moduli of underfills contaminated with flux residues also decreased significantly. The existence of flux residues was found to increase the moisture absorption of the cured underfills.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society
Starting Page	233
Ending Page	238
Page Count	6
File Size	1535670
File Format	PDF
ISSN	15213331
Volume Number	26
Issue Number	1
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2003-03-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Flip chip Substrates Moisture Temperature Absorption Soldering Curing Glass Integrated circuit packaging Costs
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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