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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Wei, X.C. Liu, E.X. Ooi, Z.Z. Li, E.P. Vahldieck, R. |
| Copyright Year | 2007 |
| Description | Author affiliation: Inst. of High Performance Comput., Singapore (Wei, X.C.; Liu, E.X.; Ooi, Z.Z.; Li, E.P.) |
| Abstract | The electromagnetic compatibility simulation of the power delivery network inside the integrated circuit packaging becomes an important issue in the modern circuit design. In this paper, this complex power-ground plane is divided into the internal region and external region. These two regions are simulated by using the hybrid integral equations. The internal integral equation is described by using the rectangular cavity dyadic green functions, while the external integral equation is described by using the free-space green function. These two equations are coupled through the equivalent magnetic current placed on the periphery and gaps of the power-ground plane. This proposed method could accurately simulate both the coupling between vias inside the power-ground plane and the emission from the periphery and gaps of the power-ground plane. Through several examples, its accuracy and efficiency are validated. |
| Starting Page | 1653 |
| Ending Page | 1658 |
| File Size | 2135222 |
| Page Count | 6 |
| File Format | |
| ISBN | 1424409845 |
| ISSN | 05695503 |
| DOI | 10.1109/ECTC.2007.374016 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2007-05-29 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Power system modeling Integral equations Circuit simulation Impedance Electromagnetic compatibility Integrated circuit packaging Conductors Integrated circuit technology Green function Semiconductor device packaging |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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