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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Min Pei Jianmin Qu |
| Copyright Year | 2007 |
| Description | Author affiliation: Georgia Inst. of Technol., Atlanta (Min Pei; Jianmin Qu) |
| Abstract | In this paper, a microstructure-dependent creep model is developed that accounts for the hierarchal micro structure at multiple length scales. The model considers three distinguishable phases in the solder alloy at two different length scales: at the larger scale Sn dendrites of micrometer size are embedded in a homogeneous eutectic phase; at a much smaller length scale the eutectic phase consists of sub-micron size $Ag_{3}Sn$ particles embedded in a homogeneous Sn matrix. The model predictions agree well with creep test data of RE doped SnAg solders. |
| Starting Page | 273 |
| Ending Page | 277 |
| File Size | 3701408 |
| Page Count | 5 |
| File Format | |
| ISBN | 1424409845 |
| ISSN | 05695503 |
| DOI | 10.1109/ECTC.2007.373809 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2007-05-29 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Creep Tin Microstructure Predictive models Testing Environmentally friendly manufacturing techniques Lead Temperature Atmospheric modeling Capacitive sensors |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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