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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Shariff, D. Suthiwongsunthorn, N. Bieck, F. Leib, J. |
| Copyright Year | 2007 |
| Description | Author affiliation: Schott Adv. Packaging Singapore Pte Ltd, Singapore (Shariff, D.; Suthiwongsunthorn, N.; Bieck, F.; Leib, J.) |
| Abstract | The wafer level packaging for optical image sensor devices developed by Schott Advanced Packaging utilizes a through silicon via (TSV) by contacting the bond pads of the image sensors from the backside. Direct contact of the bond pads from the back side of the chip offers much shorter transmission paths to the board assemblies, thus providing faster signal speed, lower ohmic contact, efficient thermal conduction and many added advantages. After forming the vias by means of plasma etching, the electrical connection from the bottom of the via to the backside of the wafer is done by spray coating and lithography to form the redistribution layer, and prepare the wafer for bumping at a later process step. Via shape and spray coating process are the key to achieve good quality and reliable product. This paper discusses interactions between the via shape (profile angle and shape) and its effects on subsequent spray coating processes as well as its impact on electrical yield and reliability of the product. The shape of the via, and its homogeneity over the wafer significantly affect the performance and stability of the next process steps, thus careful balancing of the via forming process and the lithography are required. The impact of via morphology and via stability are also studied under production conditions on the spray coating performance. |
| Starting Page | 858 |
| Ending Page | 863 |
| File Size | 4494705 |
| Page Count | 6 |
| File Format | |
| ISBN | 1424409845 |
| ISSN | 05695503 |
| DOI | 10.1109/ECTC.2007.373899 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2007-05-29 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Wafer scale integration Shape Geometry Coatings Optical devices Image sensors Wafer bonding Thermal spraying Lithography Stability |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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