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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Kiwon Lee Hyoung Joon Kim Il Kim Kyung Wook Paik |
| Copyright Year | 2007 |
| Description | Author affiliation: Korea Adv. Inst. of Sci. & Technol., Daejeon (Kiwon Lee; Hyoung Joon Kim; Il Kim; Kyung Wook Paik) |
| Abstract | In this study, a novel anisotropic conductive film (ACF) bonding method for flexible substrate-organic rigid board bonding was investigated using an ultrasonic vibration. And the ultrasonic (U/S) ACF bonding was characterized in terms of adhesion strength, electrical continuity in comparison with those of thermo-compression (T/C) bonding. An ultrasonic bonder was used to produce ultrasonic vibration in ACF joints between flexible substrates and organic rigid boards. Test boards were 25 um-thick polyimide based flexible substrates and 1 mm-thick FR-4 organic rigid boards. The effect of process conditions, such as U/S powers, bonding pressures, and bonding times on the ACF temperature were investigated. The in-situ temperature at the ACF layer was measured during U/S bonding to determine the relation between the ACF temperature and the bonding characteristics of ACF joints. The optimized U/S bonding time was obtained within 5 sec at room temperature. The significant meaning of this result is that the ACF bonding process times can be remarkably reduced by U/S bonding compared with conventional 15 sec T/C bonding at 190degC. The ACF joints with the optimized U/S bonding conditions showed similar bonding characteristics as those with T/C bonding in terms of the adhesion strength and the daisy-chain contact resistance. The fourier transformation infra-red (FTIR) spectroscopy showed that the ACF degree of cure was achieved 90 % at 3 sec and 95 % at 4 sec. Reliability test results showed that the U/S bonded test boards had stable daisy-chain contact resistances in 85degC/85 % RH test and 125degC high temperature storage test for 1000 hours and -55degC~125degC thermal cycling test for 1000 cycles. |
| Starting Page | 480 |
| Ending Page | 486 |
| File Size | 3079293 |
| Page Count | 7 |
| File Format | |
| ISBN | 1424409845 |
| ISSN | 05695503 |
| DOI | 10.1109/ECTC.2007.373841 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2007-05-29 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Anisotropic conductive films Temperature Testing Substrates Adhesives Polyimides Bonding processes Contact resistance Infrared spectra Spectroscopy |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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