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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Zaw Zaw Oo En-Xiao Liu XingChang Wei Choon, M.T.Y. Er-Ping Li Yaojiang Zhang Le-Wei Li |
| Copyright Year | 2007 |
| Description | Author affiliation: Inst. of High Performance Comput., Singpore (Zaw Zaw Oo; En-Xiao Liu; XingChang Wei; Choon, M.T.Y.; Er-Ping Li) |
| Abstract | The paper presents the development of a coupled scattering matrix method (SMM) with integral equation method for analyzing the power integrity (PI) of multilayered package structure with large number of power/ground vias. Analysis of the entire signal traces and the associated vias, connected between the power and ground, (named as P/G vias) is treated as analyzing the coupling between the external signal traces and the inside vertical vias, and analyzing the scattering effects between the vertical vias. A pair of the layered power/ground planes is considered as the parallel-plate waveguide structure. The scattering matrix method for the parallel-plate waveguide modes is developed by using the Foldy-Lax equations to analyze the scattering effects between the vertical P/G vias. The equivalent layered vias are modeled for the vertical vias connected between the power/grounds planes. The scattering matrices for coupling between the P/G vias including the signal vias are computed, and hence the outgoing wave coefficients for each via are calculated for power integrity analysis. The admittance (Y) matrix of a two-port network is modeled to represent the multiple scattering of the vertical P/G vias with the signal vias. The integral equation method is used to extract the equivalent circuit models for coupling between the external signal traces and the vertical vias. The extracted models are simulated together with the Y-matrix for signal response. |
| Starting Page | 815 |
| Ending Page | 820 |
| File Size | 2756391 |
| Page Count | 6 |
| File Format | |
| ISBN | 1424409845 |
| ISSN | 05695503 |
| DOI | 10.1109/ECTC.2007.373892 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2007-05-29 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Scattering Integral equations Electromagnetic interference Electronics packaging Transmission line matrix methods Signal analysis Planar waveguides Admittance Equivalent circuits Coupling circuits |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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