NDLI: Emission and Susceptibility Modeling of Finite-Size Power-Ground Planes Using a Hybrid Integral Equation Method

Content Provider	IEEE Xplore Digital Library
Author	Xing-Chang Wei Er-Ping Li En-Xiao Liu Eng-Kee Chua Zaw-Zaw Oo Vahldieck, R.
Copyright Year	1999
Abstract	A novel method based on hybrid integral equation for electromagnetic emission and susceptibility modeling of power-ground planes with a finite size is proposed in this paper. First, the entire computational domain is divided into the internal subdomain including the substrate sandwiched between the power and ground planes and the external subdomain surrounding the power-ground planes. The internal subdomain is modeled by using the integral equation with dyadic Green's functions of the rectangular cavity, while the free-space Green's function is used to model the outside subdomain. These two kinds of integral equations are coupled through the equivalent electric and magnetic currents that are placed on the interfaces. The key advantage of this proposed method is its ability to model both emission and susceptibility problems. This method can accurately simulate the impedance of the power-ground planes and the radiated field. In particular, it is able to predict the induced electric currents inside the power-ground planes that result from external interference sources. Therefore, this technique is able to provide a complete solution for the electromagnetic compatibility analysis of the system-level package.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society IEEE Components, Packaging and Manufacturing Technology Society
Starting Page	536
Ending Page	543
Page Count	8
File Size	1030934
File Format	PDF
ISSN	15213323
Volume Number	31
Issue Number	3
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-08-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Integral equations Green's function methods Electromagnetic modeling Couplings Impedance Current Electromagnetic radiative interference Electromagnetic compatibility Electromagnetic analysis Packaging simultaneous switching noise Dyadic Green's function electromagnetic compatibility high-speed electronic package integral equation power-ground planes
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

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