Please wait, while we are loading the content...
| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Hyoung-Joon Kim Kyung-Wook Paik |
| Copyright Year | 2007 |
| Description | Author affiliation: Korea Adv. Inst. of Sci. & Technol., Daejeon (Hyoung-Joon Kim; Kyung-Wook Paik) |
| Abstract | The effect of final metal finishes of Cu electrodes on the adhesion and reliability of anisotropic conductive film (ACF) joints was investigated. Two different metal surface finishes, electroless Ni/immersion Au (ENIG) and organic solderability preservatives (OSPs) coated on Cu, were selected in this study. These are commonly used as final metal finish materials in the printed circuit board (PCB) industry. However, the effect of OSPs coated on Cu on the adhesion and reliability of ACF joints has not been studied yet. Therefore, the adhesion and reliability of ACF/OSP joints were investigated. The results of ACF/OSP joints were compared with those of ACF/ENIG joints to evaluate the feasibility of ACF/OSP joints in real packaging applications. For electrical continuity and reliability tests, patterned flexible substrates and FR4 rigid substrates were prepared. A flexible substrate was bonded to two types of organic FR4 substrates with different metal surface finishes, ENIG and OSP, using ACFs. According to the result of contact resistance measurement, the initial contact resistances of the ACF/OSP joints, approximately 15 mOmega, were almost the same as those of the ACF/ENIG joints. For the reliability test, a pressure cooker test (PCT) was performed in order to verify the stability of the ACF/OSP joints in high temperature and humid environments. According to the results of PCT, ACF/OSP joints showed better reliability compared to ACF/ENIG joints. The adhesion strength of ACF/OSP joints was higher than that of ACF/bare Cu and ACF/ENIG joints. The fracture site of the ACF/bare Cu and ACF/ENIG joints was the ACF/metal interface, while that of ACF/OSP joints was inside the ACF. TEM and FT-IR analyses showed that the OSP coating layer on the Cu electrodes remained after ACF bonding, and OSP layer acted as an adhesion promoter to ACFs. |
| Starting Page | 1707 |
| Ending Page | 1713 |
| File Size | 6187400 |
| Page Count | 7 |
| File Format | |
| ISBN | 1424409845 |
| ISSN | 05695503 |
| DOI | 10.1109/ECTC.2007.374025 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2007-05-29 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Adhesives Anisotropic conductive films Surface finishing Substrates Testing Electrodes Bonding Gold Conducting materials Inorganic materials |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
National Digital Library of India (NDLI) is a virtual repository of learning resources which is not just a repository with search/browse facilities but provides a host of services for the learner community. It is sponsored and mentored by Ministry of Education, Government of India, through its National Mission on Education through Information and Communication Technology (NMEICT). Filtered and federated searching is employed to facilitate focused searching so that learners can find the right resource with least effort and in minimum time. NDLI provides user group-specific services such as Examination Preparatory for School and College students and job aspirants. Services for Researchers and general learners are also provided. NDLI is designed to hold content of any language and provides interface support for 10 most widely used Indian languages. It is built to provide support for all academic levels including researchers and life-long learners, all disciplines, all popular forms of access devices and differently-abled learners. It is designed to enable people to learn and prepare from best practices from all over the world and to facilitate researchers to perform inter-linked exploration from multiple sources. It is developed, operated and maintained from Indian Institute of Technology Kharagpur.
Learn more about this project from here.
NDLI is a conglomeration of freely available or institutionally contributed or donated or publisher managed contents. Almost all these contents are hosted and accessed from respective sources. The responsibility for authenticity, relevance, completeness, accuracy, reliability and suitability of these contents rests with the respective organization and NDLI has no responsibility or liability for these. Every effort is made to keep the NDLI portal up and running smoothly unless there are some unavoidable technical issues.
Ministry of Education, through its National Mission on Education through Information and Communication Technology (NMEICT), has sponsored and funded the National Digital Library of India (NDLI) project.
| Sl. | Authority | Responsibilities | Communication Details |
|---|---|---|---|
| 1 | Ministry of Education (GoI), Department of Higher Education |
Sanctioning Authority | https://www.education.gov.in/ict-initiatives |
| 2 | Indian Institute of Technology Kharagpur | Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project | https://www.iitkgp.ac.in |
| 3 | National Digital Library of India Office, Indian Institute of Technology Kharagpur | The administrative and infrastructural headquarters of the project | Dr. B. Sutradhar bsutra@ndl.gov.in |
| 4 | Project PI / Joint PI | Principal Investigator and Joint Principal Investigators of the project |
Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon |
| 5 | Website/Portal (Helpdesk) | Queries regarding NDLI and its services | support@ndl.gov.in |
| 6 | Contents and Copyright Issues | Queries related to content curation and copyright issues | content@ndl.gov.in |
| 7 | National Digital Library of India Club (NDLI Club) | Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach | clubsupport@ndl.gov.in |
| 8 | Digital Preservation Centre (DPC) | Assistance with digitizing and archiving copyright-free printed books | dpc@ndl.gov.in |
| 9 | IDR Setup or Support | Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops | idr@ndl.gov.in |
|
Loading...
|