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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Seung-Hyun Chae Chao, B. Xuefeng Zhang Im, J. Ho, P.S. |
| Copyright Year | 2007 |
| Description | Author affiliation: Univ. of Texas at Austin, Austin (Seung-Hyun Chae; Chao, B.; Xuefeng Zhang; Im, J.; Ho, P.S.) |
| Abstract | An efficient numerical method based on simulated annealing was developed to extract the diffusion and electromigration (EM) parameters for multi-phase intermetallic compounds (IMCs) formed between under-bump-metallurgy (UBM) and solder bumps. This method was applied to the growth of Cu-Sn IMCs during thermal aging and electromigration in Pb-free solder joints with Cu UBM. Diffusion coefficients and effective charge numbers of Cu and Sn in IMCs were derived in this study. The simulated annealing approach provided superior efficiency and accuracy over the conventional grid heuristics, and was proven to be particularly useful for analyzing multiple parameters in multiphase systems, such as solder joints. The effect of EM-enhanced IMC growth on stress fields in solder joints was also studied using finite element analysis. The negative volumetric strain appeared to be an important factor contributing to the degradation of EM reliability of solder joints. |
| Starting Page | 1442 |
| Ending Page | 1449 |
| File Size | 7210848 |
| Page Count | 8 |
| File Format | |
| ISBN | 1424409845 |
| ISSN | 05695503 |
| DOI | 10.1109/ECTC.2007.373985 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2007-05-29 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Intermetallic Electromigration Soldering Simulated annealing Aging Tin Analytical models Stress Finite element methods Capacitive sensors |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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