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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Sung, R. Kevin Chiang Yu-Po Wang Hsiao, C.S. |
| Copyright Year | 2007 |
| Description | Author affiliation: Siliconware Precision Ind. Co. Ltd., Taichung (Sung, R.; Kevin Chiang; Yu-Po Wang; Hsiao, C.S.) |
| Abstract | In recent years, more and more devices are designed by high-performance flip-chip ball grid array (FCBGA) packages due to the requirement on large number of I/O pads, small pitch, and high operation frequency of ASIC. Many studies were done on FCBGA packages. Some of these works were focused on thinner structures. In the study of this paper, our targets will be focused on the coreless and standard FCBGA cases. By directly replacing the BT-core of the standard substrate with a thinner build-up dielectric layer, the coreless design is a good choice to decrease the cost. This replacement makes some differences between the standard thick BT-core and the new thinner build-up substrates. Our study analyzes the electrical performance caused by these differences. With the simulation approach, the analyses include the power integrity (PI) and signal integrity (SI) issues in frequency and time domains on both coreless and standard substrates. In the final results, we found that the coreless substrates could get a better electrical performance, for examples, the smaller coupling between the signal nets, the lower impedance of the power delivery system. The results from these analyses could give a useful reference for chip designers while they make a decision on package. |
| Starting Page | 1921 |
| Ending Page | 1924 |
| File Size | 2984555 |
| Page Count | 4 |
| File Format | |
| ISBN | 1424409845 |
| ISSN | 05695503 |
| DOI | 10.1109/ECTC.2007.374062 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2007-05-29 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Performance analysis Dielectric substrates Electronics packaging Application specific integrated circuits Costs Analytical models Signal analysis Frequency domain analysis Time domain analysis Impedance |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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