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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Aggarwal, A. Markondeya Raj, P. Baik-Woo Lee Myung Jin Yim Tambawala, A. Iyer, M. Swaminathan, M. Wong, C.P. Tummala, R. |
| Copyright Year | 2007 |
| Description | Author affiliation: Georgia Inst. of Technol., Atlanta (Aggarwal, A.; Markondeya Raj, P.; Baik-Woo Lee; Myung Jin Yim; Tambawala, A.; Iyer, M.; Swaminathan, M.; Wong, C.P.; Tummala, R.) |
| Abstract | This paper reports the reliability of fine pitch interconnections using nano-structured nickel as the primary interconnection material. Assembly was accomplished with different bonding methods to provide organic compatible low-temperature fabrication. Au-Sn and Sn-Cu were used for solder-based assembly of nanonickel interconnections. Low modulus conductive adhesives impart lower stresses in the interconnections and enhance reliability though they add electrical parasitics. These were used as an alternate bonding route and compared to solders. Test vehicles were fabricated at 200 micron pitch to evaluate the reliability with different bonding routes. Different CTE substrates - FR4 with 18 ppm/C, advanced organic boards with 10 ppm/C, novel low CTE (3 ppm/C) substrates based on carbon-silicon carbide (C-SiC) were evaluated. No underfilling was used in all the test vehicles evaluated in this study. High frequency electrical characterization was performed to compare the electrical parasitics from different bonding routes. Nanometal bumps bonded with conductive adhesives showed the highest reliability withstanding 1500 cycles. This technology can be easily downscaled to submicron and nanoscale unlike the current solder technologies leading to true nanointerconnections. |
| Starting Page | 905 |
| Ending Page | 913 |
| File Size | 5232136 |
| Page Count | 9 |
| File Format | |
| ISBN | 1424409845 |
| ISSN | 05695503 |
| DOI | 10.1109/ECTC.2007.373906 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2007-05-29 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Nickel Assembly Bonding Conductive adhesives Testing Vehicles Materials reliability Conducting materials Fabrication Stress |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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