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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Hyunchul Kim Mu Zhang Kumar, C.M. Daewoong Suh Pilin Liu Dongwook Kim Mayue Xie Zhiyong Wang |
| Copyright Year | 2007 |
| Description | Author affiliation: Intel Corp., Chandler (Hyunchul Kim; Mu Zhang; Kumar, C.M.; Daewoong Suh; Pilin Liu; Dongwook Kim; Mayue Xie; Zhiyong Wang) |
| Abstract | Solder joint reliability of lead free solders (Sn-Ag-Cu) in drop testing has been an issue in mobile and handheld electronics. Since lead free solders have lower drop performance compared with Pb-Sn solders, many efforts have been reported to improve solder joint reliability with various lead free solders. In this study, standard JEDEC drop reliability tests were performed for a CSP (chip scale package) prepared with two different compositions of lead free solders (SAC405 alloy: Sn-4Ag-0.5Cu and SAC105 alloy: Sn-1Ag-0.5Cu). Lead free solders were assembled on substrates with a Au/Ni surface finish. It was seen that SAC 105 alloy solder demonstrated better drop reliability compared with SAC405 alloy solder and failure analysis conducted to understand the differences in failure modes & drop reliability performance.. The fundamental cause of improved drop reliability performance of SAC 105 solders and the advantages of using low Ag content SAC lead free solders for microelectronic devices is discussed. Finally, a finite element model was developed and validated with failure analysis to investigate the high stress concentration distribution and failure mode in solder joints for drop test stress conditions. |
| Starting Page | 962 |
| Ending Page | 967 |
| File Size | 4569430 |
| Page Count | 6 |
| File Format | |
| ISBN | 1424409845 |
| ISSN | 05695503 |
| DOI | 10.1109/ECTC.2007.373913 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2007-05-29 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Environmentally friendly manufacturing techniques Lead Soldering Electronic equipment testing Chip scale packaging Failure analysis Stress Performance evaluation Electronics packaging Assembly |
| Content Type | Text |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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