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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Das, R.N. How Lin Papathomas, K.I. Lauffer, J.M. Card, N. Markovich, V.R. |
| Copyright Year | 2007 |
| Description | Author affiliation: Endicott Interconnect Technol. Inc., Endicott (Das, R.N.; How Lin; Papathomas, K.I.; Lauffer, J.M.; Card, N.; Markovich, V.R.) |
| Abstract | This paper examines the use of nanocomposites or materials in the area of printing technology. A variety of printable nanomaterials for advanced organic packaging have been developed. This includes nano capacitors and resistors as embedded passives, nano magnetic materials, multifunctional materials, etc. Nanocomposites can provide high capacitance densities, ranging from 5 $nf/inch^{2}$ to 25 $nF/inch^{2},$ depending on composition, particle size and film thickness. The electrical properties of capacitors fabricated from $BaTiO_{3}-epoxy$ nanocomposites showed a stable capacitance and low loss over a temperature range from 25degC to 100degC. A variety of printable discrete resistors with different sheet resistances, ranging from 1 ohm to 120 Mohm, processed on large panels (19.5 inches times 24 inches) have been fabricated. Low resistivity nanocomposites, with volume resistivity in the range of $10^{-4}$ ohm-cm to $10^{-6}$ ohm-cm depending on composition, particle size, and loading can be used as conductive joints for high frequency and high density interconnect applications. Thermosetting polymers modified with ceramics can produce low k dielectrics with k value in the range between 5.41 and 3.59. Similarly, low loss dielectric materials can be produced form mixing epoxy with silica or other low loss fillers. Reliability of the nanocomposites was ascertained by IR-reflow, thermal cycling, pressure cooker test (PCT), and solder shock. Change in capacitance after 3X IR-reflow and after 1000 cycles of deep thermal cycling (DTC) between -55degC and 125degC was within 5%. Most of the nanocomposites in the test vehicle were stable after IR-reflow, PCT, and solder shock. |
| Starting Page | 316 |
| Ending Page | 322 |
| File Size | 5842964 |
| Page Count | 7 |
| File Format | |
| ISBN | 1424409845 |
| ISSN | 05695503 |
| DOI | 10.1109/ECTC.2007.373816 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2007-05-29 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Nanocomposites Packaging Magnetic materials Capacitance Capacitors Resistors Conductivity Dielectric losses Testing Electric shock |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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