NDLI: A new criterion for package integrity under solder reflow conditions

Content Provider	IEEE Xplore Digital Library
Author	Nguyen, L.T. Chen, K.L. Schaefer, J. Kuo, A.Y. Slenski, G.
Copyright Year	1995
Description	Author affiliation: Nat. Semicond. Corp., Santa Clara, CA, USA (Nguyen, L.T.; Chen, K.L.; Schaefer, J.)
Abstract	Moisture-induced package cracking during the solder reflow process is a critical reliability problem with plastic integrated circuit (IC) packaging. Such cracking, typically referred to as popcorning, occurs from the evaporation and expansion of moisture absorbed by the hygroscopic epoxy molding compound (EMC). Although the device may still test functionally good after assembly, the cracks introduce a path for ionic contaminants to infiltrate into the package and cause corrosion-induced failures. The following mechanism is proposed. Moisture in the outer and hotter portion of the EMC vaporizes first, while most of the moisture in the inner and cooler portion of the EMC remains in the liquid phase. Some localized hydrostatic pressure can become positive, generating subsequently high pressure that can initiate and propagate cracks. This paper reports the effects of the localized vaporization, which is a major albeit still neglected loading mode contributing to popcorning failures. For simplicity, only two-dimensional modeling problems are investigated in this phase of the study. Numerous moisture-induced cracking experimental data are examined to provide correlation with the proposed failure criterion. Among the parameters studied are package form factors, die-to-die pad ratio, molding compounds, moisture content, and heating profiles.
Starting Page	478
Ending Page	490
File Size	1399279
Page Count	13
File Format	PDF
ISBN	0780327365
DOI	10.1109/ECTC.1995.515324
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1995-05-21
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electromagnetic compatibility Moisture Delamination Thermal stresses Assembly Thermal management Semiconductor device packaging Plastic integrated circuit packaging Integrated circuit packaging Lead
Content Type	Text
Resource Type	Article

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