NDLI: Finite-Element Simulation of Stress Intensity Factors in Solder Joint Intermetallic Compounds

Content Provider	IEEE Xplore Digital Library
Author	Alam, M.O. Hua Lu Bailey, C. Chan, Y.C.
Copyright Year	2001
Abstract	The trend toward the miniaturization of electronic products leads to the need for very small sized solder joints, where the volume fraction of intermetallic compounds (IMCs) would be higher. In this paper, a fracture mechanics study of the IMC layer for SnPb and Pb-free solder joints has been carried out using a finite-element numerical computer modeling method. It is assumed that only one crack is present in the IMC layer. The linear elastic fracture mechanics approach is used for the parametric study of the stress intensity factors [(SIFs) K _I and K _II ] at the predefined crack in the IMC layer of the solder-butt-joint tensile sample. Contrary to intuition, it is revealed that a thicker IMC layer, in fact, increases the reliability of a solder joint for a cracked IMC-assuming that there is only a single crack that exists in the IMC layer. Even if the whole solder layer is replaced by the IMC in the solder joint, the fracture propagation possibility is greatly reduced. Values of K _I and K _II are found to decrease with the location of the crack farther away from the solder interfaces while other parameters are constant. Temperature and strain rate are also found to have a significant influence on the SIF values. It has been found that a soft solder matrix generates a nonuniform plastic deformation across the solder-IMC interface near the crack tip that is responsible for obtaining a wide range of K _I and K _II values.
Sponsorship	IEEE Electron Devices Society IEEE Reliability Society
Starting Page	40
Ending Page	48
Page Count	9
File Size	1362661
File Format	PDF
ISSN	15304388
Volume Number	9
Issue Number	1
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-03-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Finite element methods Soldering Intermetallic Tensile stress Lead Numerical models Parametric study Temperature Capacitive sensors Plastics solder joint Failure analysis finite element modeling fracture mechanics intermetallic compound reliability
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Safety, Risk, Reliability and Quality Electrical and Electronic Engineering

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