NDLI: Electromigration study of eutectic SnPb flip-chip solder joints on ceramic substrates

Content Provider	IEEE Xplore Digital Library
Author	Lin, C.K. Chih Chen Yu, H.M. Lan, J.K. Lee, D.L.
Copyright Year	2008
Description	Author affiliation: Taiwan Semicond. Manuf. Co., Hsinchu (Yu, H.M.; Lan, J.K.; Lee, D.L.) \|\| Dept. of Mater. Sci. & Eng., Nat. Chiao Tung Univ., Hsin-chu (Lin, C.K.; Chih Chen)
Abstract	This study investigates electromigration study of eutectic SnPb flip-chip solder joints on ceramic substrates. The under bump metallization (UBM) structure consists of 5-mum Cu / 3-mum Ni under bump metallization (UBM). Under the current stressing by 0.9 A at 150degC, we did not find void formation but a large amount of intermetallic compound (IMC) of $Cu_{6}(Sn,Ni)_{5}$ were formed when the bump resistance increased 10 mOmega. Three-dimensional electrical simulation by finite element analysis was carried out to simulate the current density distribution in solder joints with slit Cu traces. It is found that the current density was almost uniformly distributed in solder joint for this structure. It is found that the bump resistance only increases 0.07 mOmega when half of the solder bump was transformed into $Cu_{6}Sn_{5}$ IMC. The reason for the low crowding effect in the solder joints will be discussed in the conference.
Starting Page	259
Ending Page	261
File Size	5681073
Page Count	3
File Format	PDF
ISBN	9781424436200
DOI	10.1109/EMAP.2008.4784278
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-10-22
Publisher Place	Taiwan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electromigration Flip chip solder joints Ceramics Soldering Metallization Electric resistance Analytical models Current density Intermetallic Finite element methods
Content Type	Text
Resource Type	Article

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