NDLI: Alignment considerations in packaging array-based optical interconnects and processors

Content Provider	IEEE Xplore Digital Library
Author	Ghosh, A.K.
Copyright Year	2000
Description	Author affiliation: Sch. of Mech. & Production Eng., Nanyang Technol. Inst., Singapore (Ghosh, A.K.)
Abstract	Because of micron-level size of optical components in arrays used in high-speed optical interconnection or switching systems, and the large number of elements in such arrays, achieving the alignment necessary for the optical interconnect to operate correctly and reliably is a difficult task. A tool for quantitatively specifying the relative difficulty of aligning the arrays of optical components in an optical package is developed in this paper. The alignment of two rigid arrays, one of optical sources and the other of optical receptors is analyzed. The power coupling efficiency between the source and the receptor array elements is determined based on their sizes, inter-element spacing and distances, and the six possible types of random offsets that can occur owing to the positioning of the arrays. The cross-talk level is calculated. A statistical measure of the ease or difficulty with which an optical interconnect can be aligned is then determined. This measure, called the array-alignability, uses the probability of achieving a given efficiency of power transfer in spite of the random offsets. Since efficiency varies with changing component sizes, positioning tolerances, etc., the array-alignability depends upon various size and shape parameters. An optical interconnect or switching processor in which array-alignability is high has an easier task of alignment and is more tolerant of various offsets.
Starting Page	1493
Ending Page	1497
File Size	503265
Page Count	5
File Format	PDF
ISBN	0780359089
DOI	10.1109/ECTC.2000.853411
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-05-21
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Optical arrays Packaging Optical interconnections High speed optical techniques Optical crosstalk Optical devices Switching systems Power system reliability Power measurement Probability
Content Type	Text
Resource Type	Article

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