NDLI: US initiatives and worldwide markets for Die Products

Content Provider	IEEE Xplore Digital Library
Author	Bridges, S. Gilg, L.
Copyright Year	2000
Description	Author affiliation: Nat. Semicond. Corp., USA (Bridges, S.)
Abstract	The term Known Good Die was coined in the early 1990'S to describe integrated circuits that had been prepared for use in Multichip Modules. The ICs thus prepared were "known" to meet quality and reliability metrics at least as stringent as the equivalent packaged component. These ICs were also "known" to be expensive, difficult to assemble, fragile and a host of other negative characteristics; some of which actually had some basis in fact. Recently, leading companies in the microelectronics industry are learning that the "Known Good Die" flow can benefit the bottom line for producing high volume, highly reliable ICs at low cost for today's highly competitive environment. Consequently, the term "Known Good Die" is being used to describe the process of fully conditioning an IC, regardless of the final package form factor in which it is delivered to the customer. The companies that are providing bare die to the marketplace have therefore coined a new term, Die Products, that more fully captures the specific market segment in which these companies compete. This paper will explore the current status of the Die Products market and describe initiatives that are-currently underway to continue the improvements in infrastructure that are taking place and to insure that advances in technology are translated into value to the marketplace.
Starting Page	799
Ending Page	804
File Size	865261
Page Count	6
File Format	PDF
ISBN	0780359089
DOI	10.1109/ECTC.2000.853251
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-05-21
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Integrated circuit packaging Consumer products Electronic packaging thermal management Thermal management Integrated circuit testing Electronics packaging Microelectronics Costs Thermal conductivity Electronic equipment testing
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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