NDLI: Missing solder ball failure mechanisms in plastic ball grid array packages

Content Provider	IEEE Xplore Digital Library
Author	Zhong, C.H. Yi, S. Mui, Y.C. Howe, C.P. Olsen, D. Chen, W.T.
Copyright Year	2000
Description	Author affiliation: Broadcom Singapore Pte. Ltd., Singapore (Zhong, C.H.)
Abstract	Plastic ball grid array packages were aged at 125 and 150/spl deg/C for different time intervals from 4 to 2000 hours. Various solder ball pad metallurgy including pure Ni barrier layer (electrolytic plating) with Au protective layer from 0.48 to 1.27 /spl mu/m, Ni-P barrier layer (electroless plating) with 0.48 /spl mu/m Au protective layer and Ni-Co barrier layer with Au layer from 0.52 to 1.46 /spl mu/m were studied. Solder ball shear test was conducted at each time interval of aging. Solder ball shear strength decreased after initial hardening stage. The deterioration of solder ball shear strength was found mainly caused by the formation of intermetallic compound (IMC) layers, together with microstructure coarsening and diffusion related porosity at the interface. Sn forms different intermetallic compound layers with different Ni barrier layer. For ball pad metallurgy in this studied, two intermetallic compound layers formed after aging. A critical Au thickness value was found between 0.48 /spl mu/m to 0.7 /spl mu/m for electrolytic Ni. If Au protective layer is thinner than the critical value, separate (Au, Ni)Sn/sub 4/ IMC particles form on surface of Ni, Sn/sub 4/. If Au layer is thicker than the critical value, a continuous (Au, Ni)Sn/sub 4/ layer forms on top of Ni/sub 3/Sn/sub 4/. Thick Au layer and high aging temperature result in formation of thicker (Au, Ni)Sn/sub 4/ intermetallic compound layer in short time. For electrolytic Ni/Co plating, the critical Au thickness is thinner than pure electrolytic Ni plating in terms of continuous (Au, Ni, Co), Sn/sub y/ intermetallic compound layer formation. In shear test, fracture occurs at either interfaces or in the layer with the lowest shear strength. Once two continuous intermetallic compound layers formed, the fracture tends to occur at their interface. It was found that the bonding strength between (Au, Ni, Co),Sn/sub y/ and (Ni, Co)/sub 3/Sn/sub 4/ is higher than that between (Au, Ni)Sn/sub 4/ and Ni/sub 3/Sn/sub 4/. For ball pad metallurgy do not form two continuous intermetallic compound layers, the shear strength decrease due to the coarsening of microstructure, intermetallic particle formation and diffusion related porosity on surface of Ni/sub 3/Sn/sub 4/. A Phosphorus rich layer forms at the interface between Ni/sub 3/Sn/sub 4/ and Ni-P barrier layer after aging, fracture at this interface is not the dominate failure mode for electroless Ni/Au metallurgy.
Starting Page	151
Ending Page	159
File Size	1219998
Page Count	9
File Format	PDF
ISBN	0780359089
DOI	10.1109/ECTC.2000.853139
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-05-21
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Failure analysis Plastics Electronics packaging Gold Intermetallic Tin Aging Protection Testing Microstructure
Content Type	Text
Resource Type	Article

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