NDLI: The first entrepreneurial and practice-oriented masters program in microelectronics systems packaging

Content Provider	IEEE Xplore Digital Library
Author	Conrad, L. Tummala, R. May, G.
Copyright Year	2000
Description	Author affiliation: Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA (Conrad, L.)
Abstract	Very few programs exist today in the U.S. and around the world to produce any significant number of packaging engineers. Individuals who arrive at careers in electronic packaging do so with a single discipline background in science or engineering and are trained by industry on the job. The dynamic and global nature of the industry, however, requires an entirely different approach. As a result of this need, the Packaging Research Center (PRC) faculty together with the Center's industry members, have developed the first entrepreneurial and practice-oriented certificate program in microelectronics systems packaging. This new practice-oriented Master's program is a response to the industry need for a strong professional Master's program. It is primarily designed for students who plan to go immediately into industry after obtaining a masters degree rather than seek a Ph.D. The program has three major components: (1) an engineering component, (2) a management and business component, and (3) an internship component. The engineering component focuses on system-level understanding and hands-on laboratory experience, coupled with fundamental scientific knowledge in key packaging-related disciplines. Students who complete this component receive a microelectronic packaging certificate. The management component focuses on management of technology (particularly aimed at achieving national roadmap goals), entrepreneurship, and global aspects of the packaging enterprise. The internship consists of either a domestic or international industry experience. This paper describes the details of the program and discusses its implementation in three engineering schools at Georgia Tech.
Starting Page	1002
Ending Page	1007
File Size	668877
Page Count	6
File Format	PDF
ISBN	0780359089
DOI	10.1109/ECTC.2000.853290
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-05-21
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electronics packaging Microelectronics Technology management Engineering profession Electronics industry Industrial training Partial response channels Engineering management Knowledge engineering Laboratories
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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