NDLI: Determination of visco-elastic properties during the curing process of underfill materials

Content Provider	IEEE Xplore Digital Library
Author	Ernst, L.J. van't Hof, C. Yang, D.G. Kiasat, M.S. Zhang, G.Q. Bressers, H.J.L. Caers, J.F.J. den Boer, A.W.J. Janssen, J.
Copyright Year	2000
Description	Author affiliation: Delft Univ. of Technol., Netherlands (Ernst, L.J.)
Abstract	Thermo-setting polymers are widely used as underfill materials to improve the reliability of electronic packages. In the design phase, the influence of underfill applications on reliability is often judged through thermal and mechanical simulations, under assumed operating conditions. Because of lacking insight into the mechanical processes due to polymer curing, the impact of processing induced residual stress fields is often neglected. To investigate the evolution of stress and strain fields during the curing process it is important to assume a more appropriate starting point for subsequential process modeling. Furthermore, study of possible damage originating from the fabrication process then comes within reach. To facilitate future analysis of stress and strain fields during the curing process a cure dependent constitutive relation is assumed. An approximate investigation method for the process-dependent mechanical properties, based on DMA, is developed. As an illustration the parameter identification is performed for a selected epoxy resin.
Starting Page	1070
Ending Page	1077
File Size	922218
Page Count	8
File Format	PDF
ISBN	0780359089
DOI	10.1109/ECTC.2000.853302
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-05-21
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Curing Polymers Electronic packaging thermal management Residual stresses Capacitive sensors Materials reliability Thermal stresses Fabrication Mechanical factors Parameter estimation
Content Type	Text
Resource Type	Article

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