NDLI: Flip chip interconnect systems using wire stud bumps and lead free solder

Content Provider	IEEE Xplore Digital Library
Author	Zama, S. Baldwin, D.F. Hikami, T. Murata, H.
Copyright Year	2000
Description	Author affiliation: Georgia Inst. of Technol., Atlanta, GA, USA (Zama, S.)
Abstract	This research focuses on flip chip interconnect systems consisting of wire stud bumps and solder alloy. Conventional gold (Au) wire stud bumps and new copper (Cu) wire stud bumps were formed on the chip by wire bumping. Cu wire studs were bumped by controlling the ramp of ultrasonic power to eliminate the occurrence of under-pad chip cracks which tend to occur with high strength bonding wire. Lead free 96Sn3.5Ag0.5Cu alloy was used to interconnect the wire studs and printed circuit board. A comparison is made with conventional eutectic 63Sn37Pb alloy and 60In40Pb alloy. A more stable solder connection was created when Cu wire stud bumps were used, compared with Au wire stud bumps. The improved stability is due to reduced intermetallic compound formation with the solder alloy. Test vehicles were assembled with two different Direct Chip Attachment (DCA) processes. When a conventional flip chip assembly and reflow was used, the lead free test vehicles exhibited process failure. On the other hand, when solder reflow and underfill cure were performed at the same time by using a high accuracy flip chip bonder, the reliability of lead free test vehicles in thermal shock improved.
Starting Page	1111
Ending Page	1117
File Size	655637
Page Count	7
File Format	PDF
ISBN	0780359089
DOI	10.1109/ECTC.2000.853310
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-05-21
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Flip chip Wire Environmentally friendly manufacturing techniques Lead Copper Integrated circuit interconnections Gold Vehicles Bonding Assembly
Content Type	Text
Resource Type	Article

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