NDLI: Interface adhesion between copper lead frame and epoxy moulding compound: effects of surface finish, oxidation and dimples

Content Provider	IEEE Xplore Digital Library
Author	Jang-Kyo Kim Lebbaj, M. Liu, J.H. Ji Hoon Kim Yuen, M.M.F.
Copyright Year	2000
Description	Author affiliation: Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Technol., China (Jang-Kyo Kim)
Abstract	A comprehensive study is made of the effects of dimple and finishing material of copper alloy lead frame on interface adhesion with epoxy moulding compound. The surface plating materials studied include copper alloy, microetched copper, Ag, black oxide coating, Ni, Pd/Ni and Au/Ni plating. Special emphasis was placed on the effects of various stages in manufacturing processes, including post mould cure, thermal cycling, IR reflow and temperature and humidity storage, on the changes in interface adhesion. The interface bond strength was measured using the lead pull test. The lead frame surface was characterized using various techniques, such as atomic force microscopy, X-ray photoelectron spectroscopy, ellipsometry, Raman spectroscopy and contact angle measurements, to correlate the measured interface bond strength with the surface characteristics of various types. It was confirmed that dimples etched on the lead frame surface offered several mechanical anchoring mechanisms and much improved interface bond with moulding compound. The interface bond strength and the number of dimples exhibited roughly a linear relationship. The black oxide and Pd coated surfaces were shown to provide the strongest interface adhesion, with the highest wettability amongst various surface finishes studied. The measurement of contact angle is proved to be an efficient method of evaluating the metal surface quality for interface adhesion with polymer resin.
Starting Page	601
Ending Page	608
File Size	995173
Page Count	8
File Format	PDF
ISBN	0780359089
DOI	10.1109/ECTC.2000.853220
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-05-21
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Adhesives Rough surfaces Surface roughness Bonding Atomic measurements Force measurement Spectroscopy Copper alloys Atomic force microscopy Raman scattering
Content Type	Text
Resource Type	Article

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