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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Whitten, G. |
| Copyright Year | 2000 |
| Description | Author affiliation: Delphi Delco Electron. Syst., Kokomo, IN, USA (Whitten, G.) |
| Abstract | Lead-free solders for electronics have been actively pursued since the early 1990's here and abroad for environmental, legislative, and competitive reasons. The National Center for Manufacturing Sciences (NCMS-US), the International Tin Research Institute (ITRI-UK), Swedish Institute of Production Engineering Research (IVF-Sweden), Japan Institute of Electronics Packaging (JIEP-Japan), Improved Design Life and Environmentally Aware Manufacture of Electronics Assemblies by Lead-free Soldering (IDEALS-Europe), and, more recently, the National Electronics Manufacturing Initiative (NEMI-US) have been aggressively seeking lead-free solutions. The automotive environment is one of the toughest since it includes chemicals both solvents and salt spray, wide temperature ranges, vibration, and humidity. A change in alloy requires extensive testing and durable materials. Tests of PWB surface finishes, Tg, and thickness will be described as they relate to lead-free solder implementation. Requirements for boards and components will also be discussed. |
| Starting Page | 1410 |
| Ending Page | 1415 |
| File Size | 1121317 |
| Page Count | 6 |
| File Format | |
| ISBN | 0780359089 |
| DOI | 10.1109/ECTC.2000.853394 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2000-05-21 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Environmentally friendly manufacturing techniques Lead Automotive electronics Tin Production engineering Electronics packaging Assembly Soldering Automotive engineering Chemicals |
| Content Type | Text |
| Resource Type | Article |
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