NDLI: Methods for passive fiber chip coupling of integrated optical devices

Content Provider	IEEE Xplore Digital Library
Author	Hauffe, R. Siebel, U. Petermann, K. Moosburger, R. Kropp, J.-R. Arndt, F.
Copyright Year	2000
Description	Author affiliation: Fachgebiet Hochfrequenztech., Tech. Univ. Berlin, Germany (Hauffe, R.)
Abstract	A useful technique for high precision passive coupling of single mode optical fibres to integrated optical devices is crucial for cost effective packaging especially in multiport devices like switches and other WDM components. These devices were fabricated on two different material bases, SOI and polymers. In both cases the waveguides are based on the oversized rib waveguide concept and utilize silicon as a substrate. Two possible fabrication processes for this passive fiber chip coupling IN or ON silicon are presented and compared. The first approach involves a technology similar to flip chip fabrication using a sub- and superstrate, that allows a separate processing of V-grooves for fiber alignment and the integrated optical devices. The self aligned mounting of the chip is achieved by a V-shaped rib-groove combination created by wet chemical etching, where the rib is the exact negative of the groove so that the flip chip is put on precisely defined crystal planes rather than on sensitive edges. The second approach utilizes the same chip for waveguides and fiber alignment structures which makes it possible to define both in the same lithographic step and thereby eliminating any vertical displacement. Processing difficulties arise primarily from completely different processing requirements of fiber aligning V-grooves and integrated waveguides. The need to define patterns of the size of only several /spl mu/m in the proximity to deep grooves makes the use of an electrophoretic photoresist necessary. Both processes allow for fiber chip alignment precisions in the sub-/spl mu/m range which was also experimentally verified with coupling losses as low as 0.7 dB per end-face. The fabrication processes along with experimental and theoretical results are presented.
Starting Page	238
Ending Page	243
File Size	639465
Page Count	6
File Format	PDF
ISBN	0780359089
DOI	10.1109/ECTC.2000.853156
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-05-21
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Optical coupling Integrated optics Optical waveguides Optical fiber devices Optical fibers Optical devices Silicon Optical device fabrication Flip chip Optical polymers
Content Type	Text
Resource Type	Article

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