NDLI: Distance learning in thermal design of electronic systems

Content Provider	IEEE Xplore Digital Library
Author	Joshi, Y. Sircar, J.K. Bar-Cohen, A. Bhavnani, S. Barnes, J.
Copyright Year	2000
Description	Author affiliation: Dept. of Mech. Eng., Maryland Univ., College Park, MD, USA (Joshi, Y.)
Abstract	A three-year collaborative effort initiated by three institutions has resulted in a new paradigm for distance learning in rapidly evolving technology areas, such as electronics packaging. From the start, the team emphasized the use of multi-media technology for creating and disseminating internet delivered, re-configurable, shared modular educational materials. These modules could be used in a stand-alone fashion for re-training, or embedded in existing courses in various curricula. Using these modules, the first offering of a one semester graduate course on thermal design of electronic systems was made during Spring 1999. This included participants not only from the three original universities, but also from the industry and other universities. This course was taught once a week for three hours, live over the internet. In addition, course materials asynchronously available on the web included Power Point slides of the notes, streaming video, computational codes and virtual laboratory tours. During the second offering of this course during Spring 2000, a number of additional features have been implemented, including expanded participation and greater collaboration. This paper will concentrate on the lessons learned from teaching the second generation of this course. Ongoing efforts involving module standardization will also be described.
Starting Page	1289
Ending Page	1292
File Size	478087
Page Count	4
File Format	PDF
ISBN	0780359089
DOI	10.1109/ECTC.2000.853341
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-05-21
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Computer aided instruction Collaboration Internet Springs Educational institutions Electronic packaging thermal management Electronics packaging Educational technology Streaming media Laboratories
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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