NDLI: System level packaging of high density optoelectronic interconnections

Content Provider	IEEE Xplore Digital Library
Author	Nyquist, J.S. Sherman, C.J. Grimes, G.J.
Copyright Year	2000
Description	Author affiliation: Lucent Technol. Bell Labs., Westminster, CO, USA (Nyquist, J.S.)
Abstract	Large telecommunication switching and transmission platforms have massive interconnection requirements which have been doubling every 12-18 months. A discontinuity in interconnection requirements and total system bandwidth caused by DWDM technology and all optical switching technology is about to cause an enormous increase in interconnection requirements. This will result in a substantial increase in the number of fibers in a system, a substantial increase in the number of optical fibers per circuit board or unit in a system, and a substantial increase in the bandwidth carried per optical fiber in a system. Totally new packaging concepts will be required to cope with rapid changes. Past changes in optoelectronic packaging have tended to be evolutionary rather than revolutionary. The early years of the 2000 decade will require revolutionary changes in optoelectronic packaging in order just to keep pace with the pacing technologies and for the demand for bandwidth.
Starting Page	1272
Ending Page	1277
File Size	597522
Page Count	6
File Format	PDF
ISBN	0780359089
DOI	10.1109/ECTC.2000.853337
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-05-21
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Packaging Optical interconnections Optical fibers High speed optical techniques Optical signal processing Integrated circuit interconnections Wiring Transceivers Telecommunication switching Bandwidth
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
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9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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