NDLI: Study of a new structured leadframe based CSP, Mini-LOC

Content Provider	IEEE Xplore Digital Library
Author	Jui-Meng Jao Tzong Dar Her Chien Ping Huang Ko, E. Calub, G. Lo, R.H.Y.
Copyright Year	2000
Description	Author affiliation: Siliconware Precision Ind. Co. Ltd., Taichung, Taiwan (Jui-Meng Jao)
Abstract	A new CSP (chip scale package) package named Mini-LOC (lead on chip), mainly applied on DRAM, is developed by SPIL to offer a leadframe based CSP package with lower cost, enhanced thermal and electrical performance solution for assembly industries. Solder mask is printed on special designed non-outer lead leadframe to define pad openings for ball connections to shrink the package's size and improve its thermal and electrical performance. Finite element analysis is employed to characterize thermal, electrical performance of Mini-LOC package. A traditional TSOP-LOC package with similar I/O is also analyzed and compared to study the advantages of this new structured package. The results indicate the enhanced electrical characteristics with 61% decrease in mutual-inductance and 42% decrease in mutual-capacitance as well as the thermal performance of 35% decrease in Theta Ja (C/W) compared with those of the conventional TSOP-LOC package.
Starting Page	364
Ending Page	369
File Size	407466
Page Count	6
File Format	PDF
ISBN	0780359089
DOI	10.1109/ECTC.2000.853178
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-05-21
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Lead Chip scale packaging Packaging machines Electronics packaging Costs Assembly Testing Wire Lab-on-a-chip Finite element methods
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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