NDLI: Effect of Solder Volume on Interfacial Reactions between Eutectic Sn-Pb and Sn-Ag-Cu Solders and Ni(P)-Au Surface Finish

Content Provider	IEEE Xplore Digital Library
Author	Ourdjini, A. Hanim, M.A.A. Koh, S.F.J. Siti Aisha, I. Tan, K.S. Chin, Y.T.
Copyright Year	2007
Description	Author affiliation: Univ. of Technol. Malaysia (UTM), Johor Bahru (Ourdjini, A.; Hanim, M.A.A.; Koh, S.F.J.; Siti Aisha, I.)
Abstract	In this study, interfacial reactions between eutectic Sn-Pb and Sn-Ag-Cu with different solder volumes and electroless nickel/immersion gold (ENIG) surface finish are investigated. Soldering on copper finish has also been investigated for reference. Three different solder ball sizes (300, 500 and 700 mum) were used on the substrate surface finish pads with a diameter of 380 mum. The effect of solid state thermal ageing is also examined, focusing on the type of intermetallic compound (IMC) formed, the IMC thickness and growth rates. The results revealed that the solder volume has a significant effect on the thickness of intermetallics formed at the solder joints. The intermetallic formed in the solder with smaller volume was observed to be thicker than that in the solder with larger volume. It was also found that the eutectic Sn-Pb solder forms a thicker intermetallic and a much greater intermetallic growth rate compared to the Sn-Ag-Cu solder. Examination of solder joints microstructures revealed that several types and morphologies of intermetallics formed after reflow soldering and solid state ageing. However, the solder bump volume has no effect on the intermetallics types or morphologies. For the eutectic Sn-Pb solder, mainly $Ni_{3}Sn_{4}$ and $Ni_{3}Sn_{2}$ intermetallics formed at the solder joints whereas in the Sn-Ag-Cu solder joints (Cu, $Ni)_{6}Sn_{5}$ and (Ni, $Cu)_{3}Sn_{4}$ were observed. The investigation also revealed that more $Ag_{3}Sn$ intermetallics were observed just ahead of the solder joint interface and in the bulk of the Sn-Ag-Cu solder with the larger volume (solder ball with diameter of 700 mum).
Starting Page	437
Ending Page	442
File Size	4849007
Page Count	6
File Format	PDF
ISBN	9781424407293
ISSN	10898190
DOI	10.1109/IEMT.2006.4456491
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-11-08
Publisher Place	Malaysia
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Surface finishing Intermetallic Soldering Nickel Tin Surface morphology Copper Solid state circuits Aging Gold
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

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