NDLI: Cu ion plating as a technique for enhancing the mechanical, electrical and thermal bonding between Cu stabilizer and the RHQT-processed Nb/sub 3/Al conductors

Content Provider	IEEE Xplore Digital Library
Author	Kikuchi, A. Sakurai, Y. Tagawa, K. Takeuchi, T. Kitaguchi, H. Iijima, Y. Banno, N. Inoue, K.
Copyright Year	2002
Abstract	The surface of RHQT-processed Nb/sub 3/Al wires with pure Nb matrix are covered by a strong stable Nb oxide surface layer. In order to obtain good mechanical, electrical and thermal bonding between the Cu stabilizer and RHQT-processed Nb/sub 3/Al wires, it is required to destroy the Nb oxide layer on the surface of the wire. We tried to fabricate a thin Cu layer on the surface of the RHQT-processed Nb/sub 3/Al wires through the Cu ion-plating technique. Before electroplating of thick Cu stabilizers, Cu was ion-plated to a thickness of about 1 /spl mu/m. The Cu ion-plated wire showed no folded projections, cracks, or exfoliation of the Cu stabilizer even when the wire was bent through 180 degrees, showing that Cu and the wire were tightly bonded mechanically. This tight bonding between Cu and the wires should be due to the removal of stable Nb oxide layers from the surface of the wire. The V-I characteristic of wires that were ion-plated and then applied with an appropriate amount of Cu by an electroplating showed no quenching, and the wires were able to carry current up to the normal critical current transition. The measured values of recovery current were almost equivalent to the calculated values, showing that the ion-plated Cu/Nb interface had a very tight bond, allowing good electrical and thermal conductivity. In addition, a reel to reel Cu-ion plating apparatus for the long length wires is demonstrated, and Cu ion plating has been successfully carried out on 100 m long RHQT-processed Nb/sub 3/Al wire at present.
Sponsorship	Council on Superconductivity Appl. Superconductivity Conference Inc MIT
Starting Page	3376
Ending Page	3379
Page Count	4
File Size	871681
File Format	PDF
ISSN	10518223
Volume Number	15
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-06-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermal conductivity Bonding Conductors Wires Niobium Surface cracks Materials science and technology Critical current Conductivity measurement Current measurement Bending Cu ion-plating Cu stabilizer recovery current reel to reel apparatus RHQT-processed
Content Type	Text
Resource Type	Article
Subject	Condensed Matter Physics Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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