NDLI: Measurements and modeling of phonon cooling by electron-tunneling refrigerators

Content Provider	IEEE Xplore Digital Library
Author	Miller, N.A. Clark, A.M. Williams, A. Ruggiero, S.T. Hilton, G.C. Beall, J.A. Irwin, K.D. Vale, L.R. Ullom, J.N.
Copyright Year	2002
Abstract	We demonstrate cooling of the electrons and phonons of a silicon nitride (Si-N) membrane by solid-state refrigerators based on normal metal/insulator/superconductor (NIS) tunnel junctions. We report a temperature reduction of the Si-N membrane from 260 mK to 240 mK, while the electrons in the normal metal of the refrigerator are cooled to 145 mK. We explain the mechanism for cooling an isolated membrane and make quantitative comparisons between experiment and a finite-element thermal model. The model indicates that increasing the thermal conductivity of the cold-fingers, improving the transparency of the tunnel junctions, and reducing the power load through the membrane will make it possible to cool the membrane from 260 mK to below 170 mK. The refrigeration of a membrane makes it possible to integrate other cryogenic devices that require sub-Kelvin temperatures for optimal performance, such as thin-film sensors. We demonstrate this integration by combining NIS refrigerators with an x-ray Transition-Edge-Sensor (TES).
Sponsorship	Council on Superconductivity Appl. Superconductivity Conference Inc MIT
Starting Page	556
Ending Page	559
Page Count	4
File Size	747772
File Format	PDF
ISSN	10518223
Volume Number	15
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-06-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Phonons Cooling Refrigerators Biomembranes Electrons Thermal conductivity Temperature sensors Silicon Solid state circuits Metal-insulator structures tunneling Microrefrigerator NIS junction phonon cooling
Content Type	Text
Resource Type	Article
Subject	Condensed Matter Physics Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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