NDLI: iNEMI solder paste deposition project - First stage review optimizing solder paste printing for large and small components

Content Provider	IEEE Xplore Digital Library
Author	Shoukai Zhang Mohanty, R. Xiaodong Jiang Runsheng Mao Lee, J.C.-B. Chuan Xia Sweatman, K. Teoh, D.
Copyright Year	2009
Description	Author affiliation: Speedline, Franklin, MA, USA (Mohanty, R.) \|\| Cisco Systems, Hong Kong, China (Chuan Xia) \|\| Celestica, Suzhou, China (Teoh, D.) \|\| Integrated Service Technology, Hsinchu, Taiwan (Lee, J.C.-B.) \|\| Nihon Superior Co., Ltd., Queensland, Australia (Sweatman, K.) \|\| Indium Corporation, Clinton, NY, USA (Runsheng Mao) \|\| Alcatel-Lucent Shanghai Bell, China (Xiaodong Jiang) \|\| Huawei Technology, Zhenzhen, China (Shoukai Zhang)
Abstract	The widely recognized industry standard IPC-7525 has been used as the starting point for an experimental program that explores the effect of varying the keep out distance for 0201 and 0402 chip components, CSP and SOP with pitches down to 0.4mm, and larger components represented by CCGA. Other variables that were included in the experimental program to determine if they had an effect on the sensitivity of paste transfer to keep-out distance included stencil type, step height and solder type. In the first stage of the project the printing to each pad was measured with automated 3D SPI systems and optimum combinations of parameters identified by statistical analysis. In this paper the authors will explain the methodology chosen to achieve the project objectives and indicate the direction of likely future work. Early results indicate that a key objective of the project, to provide evidence to support the case for a reduction in the keep out
Starting Page	620
Ending Page	623
File Size	1578416
Page Count	4
File Format	PDF
ISBN	9781424443413
DOI	10.1109/IMPACT.2009.5382261
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-10-21
Publisher Place	Taiwan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Printing Statistical analysis Miniature and fine pitch components Mechanical factors Paper technology Indium consistency transfer efficiency keep-out distance US Department of Transportation Intserv networks Integrated circuit packaging Australia Assembly
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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iNEMI solder paste deposition project - First stage review optimizing solder paste printing for large and small components