NDLI: Application of self assembly monolayer (SAM) in lowering the process temperature during Cu-Cu diffusion bonding of 3D IC

Content Provider	IEEE Xplore Digital Library
Author	Dau Fatt Lim Singh, S.G. Xiao Fang Ang Jun Wei Chee Mang Ng Chuan Seng Tan
Copyright Year	2009
Description	Author affiliation: School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore (Dau Fatt Lim; Singh, S.G.) \|\| Chartered Semiconductor Manufacturing Company, Singapore (Chee Mang Ng; Chuan Seng Tan) \|\| SIMTech, Singapore (Xiao Fang Ang; Jun Wei)
Abstract	In this research work, we investigate the feasibility of lowering the bonding temperature by refining the copper surface with the application of a self assembly monolayer (SAM). First, the stability of SAM when it is subjected to different exposure environments is measured quantitatively by the change in the contact angle. The different environments includes: 1) exposure in clean room ambient; and 2) high temperature annealing. The contact angle is reduced for these two cases suggesting that SAM degrades or desorbs over a period of time and during high temperature annealing. Next, the formation of SAM is further analyzed qualitatively by X-ray photoelectron spectroscopy (XPS) to verify its adsorption and degradation properties. The result shows that SAM is able to slow down the oxidation process on copper surface. Bonding experiments are then performed in order to confirm the effectiveness of SAM in achieving a low temperature bonding. The formation of SAM has been shown useful in protecting copper surface from oxide formation; and at moderate temperature annealing (≪300 °C), it readily desorbs prior to bonding. Surface passivation with SAM can therefore help to lower the bonding temperature by provide a clean and a larger contact area for successful bonding.
Starting Page	68
Ending Page	71
File Size	1615275
Page Count	4
File Format	PDF
ISBN	9781424443413
DOI	10.1109/IMPACT.2009.5382311
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-10-21
Publisher Place	Taiwan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Surface cleaning Degradation Spectroscopy Temperature Annealing Stability Oxidation Copper Diffusion bonding Three-dimensional integrated circuits
Content Type	Text
Resource Type	Article

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