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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Liang, P. |
| Copyright Year | 2009 |
| Description | Author affiliation: Copper Clad Laminate Unit, Electronic Material Division, NAN YA Plastic Corp., 201 Tun Hwa North Road, Taipei, Taiwan (Liang, P.) |
| Abstract | In the past, high-frequency communication applications put emphasis on low loss while high speed signal transmission is required to achieve the integrity of the signal. In order to ensure the target of low loss on the CCL materials, mmost studies focus on how to reduce the polarity for resin system to achieve low Dk and low tan δ to improve the signal characteristics of high-spped transmission. The recent rapid development of IT industry demand for high-frequency communications, coupled with many researches show the composition of the CCL material, such as copper foil, glass fiber yarn and resin modification. This study intends to analyze the roughness of copper foil matte side, glass type and spreading uniformity to realize the impact on high frequency signals. Finally, we hope we can find a low cost solution for high frequency communications applications. |
| Starting Page | 236 |
| Ending Page | 239 |
| File Size | 2113576 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781424443413 |
| DOI | 10.1109/IMPACT.2009.5382132 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2009-10-21 |
| Publisher Place | Taiwan |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Couplings Composite materials Communication industry Glass industry Frequency Propagation losses Metals industry Resins Copper Textile industry |
| Content Type | Text |
| Resource Type | Article |
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